EVK-RZG3L Evaluation Kit

Introduction

Renesas’ EVK-RZG3L Evaluation Kit is a hardware development platform for evaluating the RZ/G3L and RZ/G3SE MPU families. The kit combines an attachable SMARC v2.1 CPU module with a carrier board, providing a practical starting point for assessing processor capabilities, board-level connectivity, memory resources, display and camera interfaces, and expansion options.

Its modular SMARC v2.1 architecture is a notable aspect of the platform: the CPU module carries the core processing and memory resources, while the carrier board exposes a broad set of interfaces for system development and peripheral evaluation.

What it does

The EVK-RZG3L kit supports Renesas RZ/G3L and RZ/G3SE MPU platforms. Its CPU module includes 4 GB of LPDDR4 SDRAM, 16 MB of QSPI Flash, 64 GB of eMMC memory, and a PMIC. Two microSD card slots are also provided.

The carrier board makes the module’s interfaces accessible for development work. Connectivity includes two Gigabit Ethernet interfaces, two USB 2.0 Type-A interfaces, two CAN interfaces, and eight ADC channels. For user-interface and imaging evaluation, the board provides two MIPI-DSI/LVDS interfaces and a MIPI CSI-2 camera interface.

Expansion is supported through a PCIe Gen2 four-lane slot and an M.2 Key E interface. The kit is powered through a USB Type-C input.

Applications

The available interfaces and on-board resources make the evaluation kit relevant for development and prototyping tasks such as:

• Evaluating RZ/G3L or RZ/G3SE MPU-based embedded systems
• Building display-connected embedded HMI prototypes using MIPI-DSI or LVDS
• Testing camera-connected designs using the MIPI CSI-2 interface
• Developing networked embedded equipment with Gigabit Ethernet connectivity
• Exploring CAN-connected control and monitoring nodes
• Assessing PCIe or M.2 Key E expansion in an MPU-based design
• Prototyping systems that require local flash, eMMC, or microSD storage

Design considerations

The CPU module and carrier-board arrangement follows the SMARC v2.1 standard, so system developers should account for the separation between module-level resources and carrier-board I/O when evaluating a design approach.

The board provides several high-speed and application-specific interfaces, including PCIe Gen2, Gigabit Ethernet, MIPI display links, and MIPI CSI-2. Integration planning should consider which interfaces are required for the intended prototype, as well as the physical requirements of connected displays, cameras, PCIe devices, or M.2 Key E modules.

Power is supplied through USB Type-C. Storage options span QSPI Flash, eMMC, and two microSD card slots, allowing different boot, operating-system, or data-storage arrangements to be evaluated.

Availability and further information

The source/distributor link on this page provides further product information for the Renesas EVK-RZG3L Evaluation Kit. Refer to the available datasheet and supporting documentation links for detailed electrical, mechanical, interface, and setup information.