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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

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PowerLattice Develops Power Delivery Chiplet That Cuts Power by 50%

PowerLattice has emerged from stealth with a new power delivery chiplet designed for AI accelerators, GPUs, and CPUs, claiming over 50% power reduction. By integrating power delivery directly into the processor package using stacked chiplet design, on-die inductors, and software control, the approach could reshape high-performance, modular semiconductor systems.

PowerLattice, power delivery IC, power delivery chiplet, chiplet architecture, AI accelerators, GPUs, CPUs, semiconductor startups, power efficiency, advanced packaging, high-performance computing, modular semiconductors

Microchip JANPTX TVS Devices Bring Military Qualification to Plastic Packaging

Microchip introduces MIL-PRF-19500 qualified plastic TVS diodes for aerospace and defense transient protection.

Microchip, JANPTX, TVS diode, transient voltage suppression, MIL-PRF-19500, aerospace electronics, defense electronics, surge protection, ESD protection

Littelfuse LF21173TMR and LF21177TMR Target Always-On Magnetic Sensing

Littelfuse introduces omnipolar magnetic switches designed for always-on, low-power sensing in compact systems.

Littelfuse, LF21173TMR, LF21177TMR, magnetic switch, omnipolar sensor, low power sensing, battery-powered devices, smart meters, electronic locks

RECOM RMD40-UW and RMD75-UW DC/DCs Simplify Railway Power Design

RECOM introduces 40 W and 75 W railway DC/DC modules with ultra-wide input range and full EN50155 compliance.

RECOM, RMD40-UW, RMD75-UW, railway DC/DC converter, EN50155, auxiliary power, 24V systems, industrial power, rail electronics

Chinese Researchers Create New 3D DRAM Technology

DRAM underpins modern computing, but traditional planar designs are struggling to scale as memory demands rise. Researchers at IME CAS have unveiled a novel 3D DRAM architecture using a dual-gate 4F2 2T0C cell, enabling higher density, multi-level storage, and improved performance, potentially paving the way for dramatically larger RAM capacities.

DRAM, 3D DRAM, memory technology, semiconductor research, high density memory, IME CAS, Chinese research, 3D memory, HBM, Hybrid Memory Cube, RAM scaling, computer memory, advanced semiconductors

Toshiba CUZ Series Zener Diodes Target 48 V Surge Protection

Toshiba expands its CUZ Zener diode lineup with new 56 V to 75 V devices for surge and ESD protection in 48 V systems.

Toshiba, CUZ series, Zener diode, surge protection, 48V systems, data centers, industrial electronics, network equipment

Diodes AP61040 and AP61041 Buck Converters for Low-Power Portable Systems

Diodes AP61040 and AP61041 target always-powered rails in portable devices with low quiescent current and stable regulation.

Diodes Incorporated, AP61040, AP61041, synchronous buck converter, low quiescent current, portable electronics, battery-powered design, wearables

Intel Breaking the 2nm Barrier with Panther Lake on 18A Process

As the semiconductor industry pushes beyond 2nm toward angstrom-class technologies, manufacturing faces extreme physical, economic, and scientific limits. This article explores sub-2nm scaling challenges, quantum effects, EUV and high-NA lithography costs, Intel’s 18A Panther Lake ambitions, foundry expansion in the US, and why future progress may rely on chiplets, 3D packaging, and new integration strategies rather than simple transistor shrinking.

semiconductors, sub-2nm, 2nm process, 1nm technology, angstrom-class nodes, Intel 18A, Panther Lake, EUV lithography, high-NA EUV, ASML, semiconductor manufacturing, chip fabrication, advanced process nodes, quantum effects, transistor scaling, Moore’s Law, foundry services, Intel Foundry, CHIPS Act, semiconductor supply chain, chiplets, 3D packaging, wafer-scale integration, Foveros, materials science, nanotechnology, electronics industry

Supply Chain Resilience in 2026 Is Changing

As volatility persists, supply chain resilience in 2026 is shifting from crisis response to structural design and long-term adaptability.

supply chain resilience, 2026 planning, electronics supply chain, global sourcing, risk management, procurement strategy, a2 global electronics + solutions

Passive Components Are Starting to Behave Like a Constraint Again

Early market signals suggest passive components may tighten sooner than expected in 2026, echoing patterns seen in previous MLCC shortages.

passive components, supply chain risk, 2026 planning, mlcc, capacitors, connectors, procurement, electronics supply chain, fusion worldwide

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