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OKI Develops 124-Layer PCB

OKI Circuit Technology has unveiled a groundbreaking 124-layer PCB, marking a 15% increase over the previous 108-layer standard. Engineered for next-gen high bandwidth memory (HBM) systems in AI and semiconductor inspection equipment, this 7.6mm thick board demonstrates cutting-edge advances in s...

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Tags: OKI PCB 124-layer high bandwidth memory HBM AI electronics semiconductor PCB manufacturing advanced computing aerospace defense signal integrity multilayer PCB next-gen technology

TSMC Rapid Development in SoIC Technology

TSMC is rapidly advancing its SoIC (System-on-Integrated-Chip) packaging technology, driven by major demand from Apple and AMD. SoIC enables stacking silicon dies for higher performance and smaller footprints, addressing the growing need for hypercompact, efficient designs. While challenges like ...

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Tags: TSMC SoIC semiconductor technology Apple AMD packaging embedded systems microelectronics IoT performance efficiency compact design heat management power distribution future electronics innovation

China Team Develops 6000 Transistor Chip with 2D Transistors

Chinese researchers at Fudan University have unveiled RV32-WUJI, the most advanced 2D-material-based microprocessor to date, constructed from molybdenum disulfide (MoS₂) and just three atoms thick. Packing 5,931 transistors into a functional 32-bit RISC-V CPU, the chip demonstrates that 2D semi...

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Tags: 2Dtransistors MoS2 RV32WUJI microprocessor nanotechnology FudanUniversity RISC-V edgecomputing quantumtunneling semiconductor innovation microcontrollers IoT electronics graphene atomicdesign energyefficiency chipdesign materialscience

China US Tariffs – China Changes Definition of Origin to hurt US suppliers

China’s new chip-origin rules target U.S. semiconductor exports by basing import duties on wafer fabrication location, undermining American chipmakers’ access to the Chinese market. While the U.S. scrambles with reactive policy, China’s long-term semiconductor strategy is paying off—posin...

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Tags: China semiconductors tariffs chip-origin rules US exports TSMC Intel GlobalFoundries IDM foundries trade war wafer fabrication CHIPS Act electronics supply chain tech policy

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