Latest News

The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

Not A Member? Join The Club Now!

Sensata Launches R290 Pressure and Temperature Sensor for EV Thermal Systems

Sensata launches an R290 pressure and temperature sensor with low leakage, IP69K protection and analogue, LIN and SENT outputs for EV thermal systems.

Sensata Technologies, Sensata, R290, R290 sensor, pressure sensor, temperature sensor, P+T sensor, pressure and temperature sensor, EV thermal management, thermal management, electric vehicles, BEV, PHEV, automotive electronics, automotive sensors, HVAC, heat pumps, propane refrigerant, low GWP refrigerant, PFAS-free, LIN, SENT, analogue sensor, IP69K, refrigerant sensor, EV sensors

KYOCERA AVX Adds 0201 Size to KGU RF MLCC Series

KYOCERA AVX adds an ultraminiature 0201 size to its KGU Series C0G RF MLCCs, offering ultra-low ESR and high Q for wireless and RF circuits.

KYOCERA AVX, KGU Series, KGU, KGU03, RF MLCC, MLCC, multilayer ceramic capacitor, ceramic capacitor, RF capacitor, 0201 capacitor, 0201 MLCC, C0G, NP0, Class I dielectric, ultra-low ESR, high Q, self-resonant frequency, RF design, RF matching, RF filtering, tuning circuits, DC blocking, Wi-Fi, cellular, satellite communications, broadband wireless, passive components

Bourns Launches UT-A Automotive Power Resistors for 150°C Operation

Bourns launches the AEC-Q200 compliant UT-A Series wirewound power resistors, offering 1 W to 10 W ratings and operation from -55°C to +150°C.

Bourns, UT-A Series, UT-A, wirewound resistor, power resistor, automotive resistor, AEC-Q200, AEC-Q200 resistor, high-temperature resistor, automotive electronics, passive components, resistors, power electronics, powertrain, braking systems, power conversion, motor drives, inverters, energy storage, industrial power supplies, pulse handling, ceramic resistor, ±30 ppm/°C TCR, temperature coefficient, 150°C operation, voltage regulator, capacitor discharge

SECO Launches Dragonwing IQ-2390 Industrial HMI and SBC

SECO launches a 5-inch industrial HMI and compact SBC powered by Qualcomm Dragonwing IQ-2390, with on-device AI, industrial connectivity and TSN Ethernet.

Tags: SECO, Qualcomm, Dragonwing IQ-2390, Qualcomm Dragonwing, Compact Vision 5, SBC-Dragonwing-IQ-2390, single-board computer, SBC, industrial HMI, human machine interface, embedded computing, embedded systems, edge AI, on-device AI, industrial AI, industrial automation, machine control, machine vision, building automation, industrial networking, TSN, Time-Sensitive Networking, Gigabit Ethernet, RISC-V, Clea OS, CAN, RS485, I2C, I3C, industrial computer

Melexis Adds 5 V MLX90381 Pico-Resolver for Compact Motors

Melexis expands the MLX90381 pico-resolver family with a 5 V variant offering a 2 µs refresh rate, 50,000+ rpm sensing and flexible magnetic axis selection.

Melexis, MLX90381, MLX90381 5V, pico-resolver, resolver, position sensor, rotor position sensor, magnetic position sensor, Hall sensor, Triaxis, Triaxis Hall, motor position sensing, motor control, BLDC motor, PMSM motor, DC motor, automotive electronics, automotive sensors, robotics, robotic actuators, e-bike, steering motor, braking motor, through-shaft motor, side-of-shaft sensing, AEC-Q100, ASIL B, magnetic sensing, position sensing

RECOM Launches 50 W and 100 W DC/DC Converters with 4:1 Input Range

RECOM launches the RP50-AW and RP100-FW isolated DC/DC converters with 50 W and 100 W outputs, 4:1 input ranges, efficiencies up to 94% and extended operating temperatures.

RECOM, RP50-AW, RP100-FW, DC/DC converter, isolated DC/DC converter, power converter, power electronics, 50 W DC/DC converter, 100 W DC/DC converter, 4:1 input range, wide input DC/DC, industrial power, power supply, industrial automation, transportation electronics, telecom, datacom, test and measurement, 2.25 kVDC isolation, remote ON/OFF, overvoltage protection, overtemperature protection, short-circuit protection

CXMT Now Producing Batches of HBM3E Memory

CXMT has been teasing about its memory capabilities and manufacturing for a while now, but recent reports show that the company has started to manufacture batches of HBM3E for testing. What exactly is CMXT doing, and what does this say about China’s memory capabilities?

CXMT, HBM3E, high bandwidth memory, Chinese DRAM, AI accelerator memory, domestic memory manufacturing, China semiconductor industry, HBM3E production, T-Head, Cambricon, advanced DRAM packaging, AI hardware supply chain, HBM3E testing, China memory capabilities, SMIC, HBM market, domestic AI memory, memory yield, HBM3E launch

RISC-V Now Supported by CPython

As RISC-V continues to increase in popularity with engineers, the news that CPython now supports RISC-V is greatly welcomed, showing how far RISC-V has come. So what exactly is happening, and why is this important for RISC-V?

RISC-V, CPython support, Python on RISC-V, Tier 3 platform, PEP 11, RISE Project, open instruction set architecture, RISC-V ecosystem, RISC-V build support, RISC-V software compatibility, RISC-V hardware testing, Sovereign Tech Agency, RISC-V CI integration, RISC-V optimisations, open source processor, RISC-V adoption, processor architectures, Python performance improvements, RISC-V vs ARM, RISC-V vs x86

Two Engineers Create and Verify Chip Design with AI in Two Weeks

Demonstrating the speed at which AI can accelerate workloads, two engineers recently designed and verified a chip design in under two weeks. But what exactly did the engineers build, and what does this say about the role of AI in engineering work?

AI chip design, Architect Labs Redwood, AI in engineering, automated hardware verification, RTL design automation, FPGA AI models, AI workflow chip development, AI-generated hardware, chip design automation, AI engineering tools, VHDL AI, Verilog AI, semiconductor AI, AI feedback loop, AI hardware bottleneck, ASIC design AI, AI for firmware generation, AI-powered chip verification, AI vs human engineering, future of chip design

Is On-Device AI Starting to Change What We Expect From a PC?

HUMAIN Horizon Ultra combines the Qualcomm Snapdragon X2 Elite CPU, GPU and NPU compute. We look at what the launch tells us about on-device AI and the changing architecture of the PC.

Qualcomm, HUMAIN, Horizon Ultra, Snapdragon X2 Elite, Snapdragon, Qualcomm Oryon, Oryon CPU, Qualcomm Hexagon, Hexagon NPU, Qualcomm Adreno, AI PC, on-device AI, edge AI, NPU, neural processing unit, CPU, GPU, PC architecture, Arm computing, Windows on Arm, Windows PC, artificial intelligence, local AI, hybrid AI, enterprise computing, AI hardware, personal computing

1 2 3 4 5 6 …84