
XLamp XFLMNB White LEDs
Cree LEDTCC-2026-09-24-xlamp-xflmnb-white-leds
High-intensity XLamp XFLMNB white LEDs optimized for flashlights and other portable lighting applications.
Introduction
Cree LED’s XLamp XFLMNB family is a high-intensity white LED line for portable lighting where a concentrated, long-distance beam is important. The 5.00 mm platform is intended to work with secondary optics to maximize candela, making the devices especially relevant to flashlight-style designs that prioritize beam focus rather than broad-area illumination.
The family is offered with ANSI white-bin options at 6500 K and 5700 K. At a junction temperature of 25°C and a drive current of 1000 mA, the specified luminous-flux range is 480 lm minimum to 520 lm typical.
What it does
XLamp XFLMNB LEDs convert electrical input into high-output white light for focused portable illumination. Their 120° FWHM viewing angle provides a broad native emission pattern, while the platform is designed for use with secondary optics that shape that output into a higher-candela beam.
The available white-bin choices support designs targeting either a 6500 K or 5700 K white appearance. At the stated 1000 mA, 25°C junction-temperature condition, forward voltage is specified from 2.7 V minimum to 3.1 V maximum. The LEDs are also specified for junction temperatures up to 150°C and have a junction-to-solder-point thermal resistance of 0.3°C/W.
Applications
- Handheld flashlights requiring focused, long-distance illumination
- Portable search or inspection lights
- High-intensity battery-powered lighting products
- Lighting assemblies using secondary optics to concentrate a white LED beam
- Compact illumination systems where thermal management and high drive current are design factors
Design considerations
The XFLMNB family should be integrated with attention to both optical and thermal design. Its 5.00 mm platform is intended to deliver maximum candela through secondary optics, so reflector or lens selection will be central to achieving the desired beam pattern. The specified 120° FWHM viewing angle describes the LED’s native emission, not necessarily the final beam after optics are added.
Electrical design should account for the specified forward-voltage range of 2.7 V to 3.1 V at 1000 mA and 25°C junction temperature, as well as the stated voltage temperature coefficient of -1.4 mV/°C. The listed DC forward current is 9000 mA, while the published flux figures are stated at 1000 mA; operating conditions should therefore be checked against the datasheet rather than inferred from the nominal flux test point.
Thermal control remains important in high-intensity LED assemblies. The 0.3°C/W junction-to-solder-point thermal resistance and 150°C maximum junction temperature provide relevant inputs for board, solder-point, and heatsinking design. The LEDs are compatible with J-STD-020C reflow processing and are identified as UL recognized components.
Availability and further information
Further technical details, including operating limits, optical data, binning information, and assembly guidance, are available through the source/distributor and datasheet links on this page.
Specifications
| Manufacturer | Cree LED |
|---|---|
| Part number | TCC-2026-09-24-xlamp-xflmnb-white-leds |
| Series | XLamp |
| Family | XFLMNB |
| Release date | 2026-09-24 |
| Viewing angle | 120° FWHM |
| UL recognition | UL recognized component |
| Forward voltage | 2.7V minimum at 1000mA and 25°C; 3.1V maximum at 1000mA and 25°C |
| DC forward current | 9000mA |
| Binning temperature | 25°C |
| Reflow compatibility | J-STD-020C |
| Minimum luminous flux | 480lm at 1000mA and 25°C junction temperature |
| Typical luminous flux | 520lm at 1000mA and 25°C junction temperature |
| ANSI white bin options | 6500K; 5700K |
| Voltage temperature coefficient | -1.4mV/°C |
| Maximum LED junction temperature | 150°C |
| Thermal resistance, junction to solder point | 0.3°C/W |
