Latest Components
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Texas Instruments MCF8329RRYEVM PowerDescription
The Texas Instruments MCF8329RRYEVM Driver Evaluation Module (EVM) enables users to evaluate the performance of a 32-pin VQFN packaged MCF8329 motor driver. It includes an onboard FTDI chip for USB to UART communication and an MSP430FR2355 microcontroller for control signal translation. This module features user-selectable jumpers, resistors, connectors, and test points for comprehensive evaluation.
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Texas Instruments DRV8351EVM PowerDescription
Texas Instruments DRV8351EVM Driver Evaluation Module (EVM) is used to evaluate the DRV8351, a gate driver IC for three-phase motor drive applications. It features high-accuracy trimmed half-bridge drivers capable of driving high-side and low-side N-type MOSFETs. The module includes reference software for motor control and system monitoring.
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Analog Devices Inc. ADAQ4216 PowerDescription
The Analog Devices ADAQ4216 µModule® Precision Data-Acquisition (DAQ) simplifies the development of precision measurement systems by integrating essential signal processing components. It features a maximum ±3ppm INL and operates within a temperature range of -40°C to +105°C. This compact solution is designed for high performance with a throughput of 2MSPS and a total system dynamic range of 123dB.
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Texas Instruments LMK5B12212EVM PowerDescription
The Texas Instruments LMK5B12212EVM Evaluation Module is designed for the LMK5B12212 network clock generator and synchronizer, suitable for device evaluation and system prototyping. It features three digital PLLs and three analog PLLs with programmable loop bandwidth, along with SMA connectors for easy interfacing. The module can be configured via a USB microcontroller interface using TICS Pro software.
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TDK Corporation HVC43MC PowerDescription
The HVC43MC is a high-voltage contactor designed for harsh environments, featuring an integrated mirror contact for reliable status monitoring. It can handle continuous currents up to 250 A and cut-off currents up to 450 A at 1000 V (DC). This contactor is ideal for applications such as EV traction battery systems and energy storage systems.
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TDK Corporation B82804E PowerDescription
The EPCOS EP9 series is a compact gate driver transformer designed for IGBT and FET circuits, optimized for 500 V systems. It features exceptional insulation, minimal coupling capacitance, and high thermal resilience, making it suitable for demanding e-mobility and industrial applications. With a height of just 11 mm and a footprint of 13 x 11 mm, it operates across a wide temperature range of -40 °C to +150 °C.
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TDK B58043E9563M052 PowerDescription
CeraLink is a high-voltage ceramic capacitor designed for power electronic applications, offering significant advantages over standard multilayer ceramic capacitors (MLCCs). It excels in fast-switching applications, particularly with silicon carbide (SiC) and gallium nitride (GaN) technologies, by providing high capacitance and low equivalent series resistance. This makes CeraLink ideal for enhancing efficiency and reducing costs in power module applications.
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TDK Corporation CeraCharge PowerDescription
TDK has developed the CeraCharge, a next-generation solid-state battery with an energy density of 1,000 Wh/L, which is approximately 100 times greater than conventional solid-state batteries. This innovative battery utilizes oxide-based solid electrolyte technology, ensuring enhanced safety and performance for wearable devices. It is designed to replace coin cell batteries, contributing to environmental sustainability.
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TDK Corporation FS1606-0600-AL PowerDescription
The FS160* series of microPOL DC-DC converters from TDK offers full telemetry and exceptional power density in a compact size of 3.3 mm x 3.3 mm x 1.35 mm. Designed for high-performance applications, these modules operate across a wide temperature range and are ideal for integration with ASICs, SoCs, and FPGAs. With models ranging from 3A to 200A, they cater to diverse needs in big data, AI, and IoT.
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TDK Corporation FS1606 PowerDescription
The FS1606 is a microPOL DC-DC converter module that offers full telemetry and operates at a wide temperature range of -40 °C to 125 °C. With its compact dimensions of 3.3 mm x 3.3 mm x 1.35 mm, it provides extraordinary power density and is ideal for integration with ASICs, SoCs, and FPGAs. This module is designed for high power-density applications, making it suitable for big data, machine learning, and IoT.
