Latest Components

NXP BYLink System Power Platform

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NXP BYLink System Power Platform Power

Description

The NXP BYLink System Power Platform is a scalable and expandable power management solution designed for complex SoCs and multiple peripherals in industrial and automotive applications. It integrates various NXP PMIC devices to work together as a single, safe, and flexible power solution. The platform supports multi-vendor processors and simplifies safety analysis and power sequencing.

Nordic Semiconductor nRF21540 DB Development Bundle

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Nordic Semiconductor nRF21540 DB Semiconductors

Description

The nRF21540 DB is a development bundle featuring both an evaluation kit (EK) and a development kit (DK) with an integrated nRF21540 RF front-end module for 2.4 GHz wireless range extension. It is designed for easy integration and testing with Nordic's nRF52 and nRF53 Series SoCs, supporting Bluetooth LE, Thread, Zigbee, and proprietary protocols. The bundle enables superior wireless range and robustness for applications such as industrial, smart home, and asset tracking.

STEVAL-DPSTPFC1 - 3.6 kW Totem Pole PFC with Inrush Current Limiter Reference Design

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STMicroelectronics STEVAL-DPSTPFC1 Power

Description

The STEVAL-DPSTPFC1 is a 3.6 kW bridgeless totem pole boost circuit reference design featuring digital power factor correction (PFC) and an inrush current limiter. It utilizes advanced ST power devices including a SiC MOSFET, SCR, isolated FET driver, and a 32-bit MCU for high efficiency and low THD. This robust design meets EMC standards and is ideal for compact, high-performance power conversion applications.

NXP iMX RT1064

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NXP MIMXRT1064DVL6A Semiconductors

Description

The NXP iMX RT1064 is a high-performance crossover MCU based on the Arm Cortex-M7 core, operating at up to 600 MHz. It features extensive connectivity, memory, and multimedia support, making it ideal for applications like EV charging stations. The MCU is supported by MCUXpresso SDK, FreeRTOS, and Zephyr OS for rapid IoT development.

LAN9360 AVB Audio Endpoint

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Microchip LAN9360 Semiconductors

Description

The LAN9360 is a fully integrated Ethernet Audio Video Bridging (AVB) endpoint solution for automotive applications. It supports uncompressed audio data transfers over Ethernet AVB networks and includes integrated AVB/TSN protocol stacks for seamless connectivity. Designed for compliance with IEEE, Avnu, and IETF standards, it enables rapid development of AVB-capable products.

Trust Platform Design Suite v2

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Microchip SW-TPDSv2 Semiconductors

Description

The Trust Platform Design Suite v2 is Microchip's dedicated software platform for onboarding embedded security solutions. It supports Secure Element provisioning, development, and education for secure IoT applications. The suite is compatible with Windows, macOS, and Linux.

Microchip SST26LF064RT 64-Mbit Radiation Tolerant

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Microchip SST26LF064RT Semiconductors

Description

The SST26LF064RT is a 64-Mbit Radiation Tolerant Serial Quad I/O (SQI) flash memory device designed for high reliability in space and high-reliability applications. It features a high-speed 4-bit multiplexed I/O serial interface and is compatible with SPI protocol. Its proprietary SuperFlash® technology ensures low power consumption and enhanced performance.

Microchip ATECC608B-TFLXTLS

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Microchip ATECC608B-TFLXTLS Semiconductors

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The ATECC608B-TFLXTLS is a secure element designed for TLS systems, offering hardware-based cryptographic key storage and advanced security protocols such as ECDH and ECDSA. It comes pre-configured for common authentication use cases and is compatible with a wide range of MCUs and MPUs. Its ultra-low power consumption and small form factor make it ideal for IoT, industrial, and embedded applications.

Microchip Radiation Hardened Isolated DC-DC Converters

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Microchip SA50 Series Power

Description

The SA series of DC-DC converters offers both triple and single output options, designed for space applications with radiation-hardened construction. These converters operate at a fixed frequency of 220 kHz and are qualified for Total Ionizing Dose (TID) and Single Event Effects (SEE). They provide up to 56W output, high efficiency, and are compliant with MIL-STD standards.

Renesas GreenPAK™ Family

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Renesas GreenPAK Family Semiconductors

Description

The Renesas GreenPAK™ Family consists of cost-effective NVM programmable mixed-signal ICs that allow designers to integrate multiple system functions into a single custom circuit. These devices help reduce component count, board space, and power consumption while offering high reliability and design security. The GreenPAK Designer software enables rapid, graphical configuration and testing of custom circuits.

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