Latest Components
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Renesas ISL71001SLHM/SEHM, ISL71610SLHM, ISL71710SLHM, ISL73033SLHM PowerDescription
Renesas offers a portfolio of radiation-hardened plastic-packaged switching regulators and related devices for satellite power management. These ICs provide space-grade reliability, reduced size and weight, and cost advantages for harsh space environments. The lineup includes buck regulators, digital isolators, and GaN FET drivers.
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Microchip PolarFire SoC SemiconductorsDescription
The Microchip Smart Embedded Vision platform is a development tool for designers using the low-power PolarFire RISC-V SoC FPGA for embedded vision applications at the edge. It enables secure and reliable system design for applications such as neural network inferencing, IIoT, and factory automation. The platform supports dual 4K video processing, quad-core RISC-V processors, and a wide range of connectivity and expansion options.
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Octavo Systems OSD32MP15x SemiconductorsDescription
The OSD32MP15x is a highly integrated System-in-Package featuring an STM32MP1 dual-core Arm Cortex-A7 and Cortex-M4, up to 1GB DDR3L, PMIC, EEPROM, MEMS oscillator, and passives in a compact 18mm x 18mm BGA. It delivers full microprocessor performance in a microcontroller-sized footprint, simplifying hardware design and reducing board space. Ideal for embedded applications requiring high integration and connectivity.
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Octavo Systems OSD335x-SM SemiconductorsDescription
The OSD335x-SM is a compact System-in-Package integrating a TI Sitara AM335x ARM Cortex-A8 processor, DDR3 memory, power management IC, LDO, EEPROM, and passives in a 21mm x 21mm BGA. It offers programmable I/O voltage domains, accessible low power modes, and a simplified layout for rapid design. Ideal for space-constrained ARM-based applications requiring high integration.
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Quectel EG12 series ConnectorsDescription
The Quectel EG12 series are LTE-A Cat 12 modules in a compact LGA form factor, supporting 3GPP Release 12. They deliver up to 600 Mbps downlink and 150 Mbps uplink, with MIMO technology for enhanced data rate and reliability. These modules are ideal for IoT applications requiring fast, reliable data transmission and broad compatibility.
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Quectel EG060V-EA ConnectorsDescription
The EG060V-EA is an LTE-A Category 6 module in an LGA form factor, supporting maximum downlink rates of 300Mbps and uplink rates of 50Mbps. It features MIMO technology for enhanced data rates and reliability, and is optimized for EMEA, APAC, and Brazil networks. The module is suitable for a wide range of IoT applications including industrial routers, gateways, and digital signage.
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Microchip 2ASC-12A2HP PowerDescription
The AgileSwitch 2ASC-12A2HP is a 1200V dual-channel, configurable digital gate driver designed for silicon carbide MOSFETs. It features Augmented Switching™ technology to reduce switching losses by up to 50% and provides multiple levels of control and protection for power systems. The driver is production qualified for demanding transportation and industrial applications.
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Quectel EG06 series ConnectorsDescription
The Quectel LTE-A EG06 series are LTE-A Cat 6 IoT modules in an LGA form factor, supporting maximum downlink rates of 300Mbps and uplink rates of 50Mbps. They feature MIMO technology for enhanced data rate and link reliability, and integrated multi-constellation GNSS for accurate positioning. These modules are ideal for industrial routers, gateways, PDAs, and digital signage applications.
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Quectel EM05 series ConnectorsDescription
The Quectel LTE EM05 series are LTE Cat 4 IoT modules in a standard M.2 (NGFF) form factor, supporting multiple cellular networks and MIMO technology for reliable high-speed data. They offer maximum downlink rates of 150Mbps and uplink rates of 50Mbps, with broad compatibility for industrial and IoT applications. The modules feature extended temperature range and support for various internet protocols and interfaces.
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Quectel EG95 series ConnectorsDescription
The Quectel LTE EG95 series are LTE Cat 4 IoT modules in a compact LGA package, supporting maximum downlink rates of 150Mbps and uplink rates of 50Mbps. They are pin-to-pin compatible with Quectel's UMTS/HSPA+ and LPWA modules, enabling easy migration from 2G/3G to 4G. Designed for low-power, size-constrained IoT applications, the modules feature an embedded power management unit and broad network compatibility.
