Latest Components
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Micron MTSD1T0AKC7MS-1WTCS PassivesDescription
The Micron c200 microSD card offers up to 1TB of removable storage, optimized for 4K HDR video capture and high-speed file transfers. It is designed for use in consumer cameras, drones, smartphones, and game consoles. The card features UHS-I C10, U3, A2, V30 speed classes and supports burst performance.
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Microchip MCP33151(D)/41(D)-10/05 SemiconductorsDescription
The MCP33151(D)/41(D)-10/05 is a 14-bit, single-channel, SAR analog-to-digital converter (ADC) with high performance and low power consumption. It features a SPI serial interface and is designed for demanding automotive and industrial environments. Ideal for high-precision data acquisition, battery-powered systems, and motor control applications.
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onsemi NCP1096 PowerDescription
The NCP1096 is a high-performance, full-featured Power over Ethernet (PoE) powered device interface controller with an integrated hot swap FET, compliant with IEEE 802.3bt. It incorporates all necessary PoE functions such as detection, classification, and current limiting, supporting up to 90W output for high-power applications. Autoclass support optimizes power allocation for improved energy efficiency.
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Avnet Silica AW-Cu300A WiFi Shield OptoelectronicsDescription
The Avnet Silica WiFi Shield is based on the AW-Cu300A module and features Arduino and Pmod connectors for broad compatibility. It integrates the Marvell 88MW300 WiFi SoC, supporting Wi-Fi 802.11 b/g/n and easy programming via UART. The board is ideal for adding wireless connectivity to development platforms and supports both standalone and shield applications.
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Nexperia AEC-Q100 MicroPak SemiconductorsDescription
Nexperia's AEC-Q100 Logic in MicroPak packages offer automotive-qualified mini logic functions in ultra-compact, leadless XSON packages. These devices are ideal for space-constrained automotive applications, providing single and dual gate logic in LVC, AUP, and AVC technologies. They deliver reliable board bonding, significant PCB space savings, and low power consumption.
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STMicroelectronics LSM6DSOX SensorsDescription
The LSM6DSOX is a high-performance 6-axis IMU combining a 3D digital accelerometer and 3D digital gyroscope with ultra-low power consumption. It features a machine learning core, finite state machine, and advanced digital functions for motion tracking and gesture detection in IoT, gaming, and wearable devices. The device supports multiple interfaces and offers robust performance in a compact LGA package.
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Nordic Semiconductor nRF9160 DK SemiconductorsDescription
The nRF9160 DK is a single-board development kit for the nRF9160 SiP, supporting LTE-M, NB-IoT, and GPS for cellular IoT applications. It features multiple antennas, Arduino Uno compatibility, user-programmable LEDs and buttons, and onboard debugging. Ideal for rapid prototyping in asset tracking, smart city, agriculture, and industrial IoT.
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Nordic Semiconductor nRF9160 SemiconductorsDescription
The nRF9160 is a compact, highly-integrated System-in-Package featuring an Arm Cortex-M33 processor, LTE-M/NB-IoT modem, GPS, and advanced security features. It is designed for low power cellular IoT applications, supporting global operation and secure firmware updates. The device includes a wide range of interfaces and peripherals, making it ideal for asset tracking, smart city, agriculture, and wearable applications.
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STMicroelectronics SMA4F, SMA6F SemiconductorsDescription
STMicroelectronics' 400W and 600W TVS diodes offer high efficiency and robust protection in a thin, compact SMA package. They are designed to withstand high transient voltage surges and operate reliably at temperatures up to 175°C. These TVS devices are ideal for space-constrained applications like SMPS and drones, providing footprint compatibility with standard SMD packages.
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Mercury Systems BuiltSECURE DDR4 8GB SemiconductorsDescription
Mercury Systems BuiltSECURE High Density Secure Memory is a military-grade DDR4 SDRAM device with 8GB capacity in an ultra-compact BGA package. It is designed for reliability in SWaP-constrained, processing-intense environments and supports data rates up to 2666 MB/s over an extended temperature range. The device features advanced 3D packaging for high density and ruggedness, making it ideal for demanding military and aerospace applications.
