Latest Components
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onsemi FFSB0665A SemiconductorsDescription
The onsemi 650 V Silicon Carbide (SiC) Schottky Diodes offer high efficiency, high power density, and enhanced reliability for demanding applications. These diodes feature zero reverse recovery, low forward voltage, and are available in a range of surface mount and through-hole packages. Ideal for PFC and boost converters in solar inverters, EV/HEV chargers, telecom, and data center power supplies.
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Renesas SC14CVMDECT OptoelectronicsDescription
The SC14CVMDECT is a fully integrated cordless voice module featuring a radio transceiver, baseband, and complete protocol stack for DECT, DECT 6.0, and J-DECT. It enables rapid development of cordless applications with minimal RF expertise required. The module supports voice and low-speed data, and is ideal for intercoms, baby monitors, and industrial control systems.
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Renesas SC14WAMDECT OptoelectronicsDescription
The SC14WAMDECT is a complete, pre-tested wireless audio module designed for public address and tour guide systems, supporting both EU-DECT and US-DECT bands. It integrates a baseband, radio transceiver, power amplifier, and crystal, and can be configured as either a base station or portable part. The module is fully certified, interference-free, and simplifies system development without requiring RF expertise.
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Renesas RAA210XXX PowerDescription
The Renesas RAA210XXX series are fully-encapsulated step-down switching power modules designed for high-density power delivery in ASIC, FPGA, and DSP applications. Featuring ChargeMode™ control architecture, they offer fast transient response, high efficiency, and real-time system monitoring via PMBus. These modules support output currents from 25A to 80A and are available in compact HDA packaging for improved thermal performance.
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Renesas ISL81601 PowerDescription
The ISL81601 is a true bidirectional 4-switch synchronous buck-boost controller for efficient DC-DC power conversion, featuring peak and average current sensing and robust multilayer overcurrent protection. It supports wide input and output voltage ranges and delivers smooth mode transitions with high efficiency up to 99%. The device is ideal for applications such as battery backup, industrial automation, and renewable energy systems.
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Renesas AE-CLOUD2 SensorsDescription
The Renesas Synergy AE-CLOUD2 evaluation kit enables rapid prototyping and development of global LTE IoT cloud-connected applications. It supports Cat-M1, Cat-NB1, 2G/EGPRS, GPS, and includes a variety of onboard sensors for IoT projects. The kit allows easy connection to major cloud services and is ideal for evaluating cellular IoT solutions.
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Microchip MCP14A0303/4/5 SemiconductorsDescription
The MCP14A0303/4/5 are high-speed dual MOSFET drivers capable of providing up to 3A peak output current from a 4.5V to 18V supply. They offer three output configurations: dual inverting, dual noninverting, and complementary, with low shoot-through current and short propagation delays. Integrated enable functionality and robust latch-up and ESD protection make them ideal for high-frequency switching applications.
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Rohm BD9S PowerDescription
The Rohm BD9S series are ultra-compact automotive secondary buck DC/DC converters designed for high reliability and low power consumption in ADAS applications such as radars, cameras, and sensors. These converters offer class-leading miniaturization, high efficiency up to 90%, and output currents ranging from 0.6A to 4.0A. Features include enable control, output voltage indicator, and optimized design for reduced interference and improved power savings.
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STMicroelectronics A3G4250D SensorsDescription
The A3G4250D is a low-power, 3-axis digital gyroscope designed for automotive telematics and navigation applications. It features a wide supply voltage range, I2C/SPI digital output, and high stability over temperature and time. The device is suitable for in-dash navigation, telematics, and motion control systems.
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onsemi MARS OptoelectronicsDescription
The onsemi MARS is a modular imaging platform designed for automotive camera system development. It enables engineers to combine various image sensors, co-processors, and communication standards using interchangeable boards. This flexible system accelerates development cycles and reduces design effort for next-generation automotive imaging solutions.
