Latest Components

STMicroelectronics SCT040H120G3AG

Manufacturer

Part #

Category

STMicroelectronics SCT040H120G3AG Power

Description

The SCT040H120G3AG is an automotive-grade silicon carbide Power MOSFET rated at 1200 V, 40 mOhm, and 40 A in an H2PAK-7 package. It features very low RDS(on) across the temperature range, high-speed switching, and a robust intrinsic body diode. Designed for high efficiency and compact systems in electric traction inverters, DC/DC converters, and on-board chargers.

STMicroelectronics SCT025W120G3-4AG

Manufacturer

Part #

Category

STMicroelectronics SCT025W120G3-4AG Semiconductors

Description

The SCT025W120G3-4AG is an automotive-grade silicon carbide Power MOSFET rated at 1200 V, 27 mOhm typical, and 56 A in a HiP247-4 package. It features very low RDS(on) across the temperature range, high-speed switching, and a robust intrinsic body diode. This device is ideal for applications such as main inverters, DC/DC converters, and on-board chargers in electric vehicles.

STMicroelectronics SCT015W120G3-4AG

Manufacturer

Part #

Category

STMicroelectronics SCT015W120G3-4AG Power

Description

The SCT015W120G3-4AG is an automotive-grade silicon carbide Power MOSFET rated at 1200 V, 15 mOhm typical, and 129 A in a HiP247-4 package. It features very low RDS(on) across the temperature range, low capacitance, and high switching speed for improved efficiency and compact system design. Ideal for main inverters, DC/DC converters, and on-board chargers in electric vehicles.

Panasonic PAN1783 Bluetooth 5.3 Low Energy (LE) Module

Manufacturer

Part #

Category

Panasonic PAN1783 Optoelectronics

Description

The PAN1783 is a Bluetooth 5.3 Low Energy module based on the Nordic nRF5340 single chip controller, featuring isochronous channels and LE audio. It offers high throughput, long range, and ultra-low current consumption, making it ideal for advanced peripherals, wearables, and wireless audio devices. The module supports standalone operation with dual Cortex-M33 processors and includes NFC-A for simplified pairing and payment solutions.

DEEPX DX-M1 M.2 LPDD5Rx2

Manufacturer

Part #

Category

DEEPX DX-M1 M.2 LPDD5Rx2 Semiconductors

Description

The DEEPX DX-M1 M.2 LPDD5Rx2 is an AI accelerator module that delivers up to 25 TOPS of performance at just 2-5W, enabling server-grade AI inference at the edge. It features an M.2 2280 form factor, PCIe Gen.3 x4 interface, and 4GB LPDDR5 memory. Ideal for edge cameras, robotics, smart cities, and other AIoT applications.

DEEPX DX-M1

Manufacturer

Part #

Category

DEEPX DX-M1 Semiconductors

Description

The DEEPX DX-M1 is a highly efficient AI accelerator chip designed for edge computing, delivering up to 25 TOPS performance at just 2-5W power consumption. It supports multiple AI models simultaneously and is compatible with major AI frameworks and both x86 and ARM architectures. Ideal for applications in smart factories, robotics, smart cities, and edge devices.

TRIA SM2S-ZUSP Compute Module

Manufacturer

Part #

Category

TRIA SM2S-ZUSP Semiconductors

Description

The TRIA SM2S-ZUSP is a compute module based on the Xilinx Zynq UltraScale+ MPSoC, supporting ZU2, ZU3, ZU4, or ZU5 FPGA complexity. It features dual or quad-core ARM Cortex-A53 processors, dual ARM Cortex-R5 real-time processors, and a range of high-speed interfaces for embedded applications. The module is SMARC 2.0 compliant and ideal for advanced analytics, industrial automation, and IoT solutions.

TRIA SM2S-RYZ2 Compute Module

Manufacturer

Part #

Category

TRIA SM2S-RYZ2 Semiconductors

Description

The TRIA SM2S-RYZ2 is a compact embedded compute module based on the AMD Ryzen Embedded R2000 processor family. It integrates CPU, GPU, and I/O on a single die, supporting up to 8GB DDR4 memory and multiple high-speed interfaces. Designed for high performance in space- and power-constrained environments, it supports up to four independent 4K displays.

TRIA SM2S-RYZ Compute Module

Manufacturer

Part #

Category

TRIA SM2S-RYZ Semiconductors

Description

The TRIA SM2S-RYZ is a compact embedded compute module based on the AMD Ryzen Embedded V1000/R1000 processor family. It integrates processing, graphics, and I/O on a single die, supporting up to 4 independent 4K displays and up to 8GB DDR4 memory. This SMARC 2.1 short size module is ideal for space- and power-constrained embedded applications.

FRDM-MCXE247 - FRDM Development Board for MCX E245/246/247 MCUs

Manufacturer

Part #

Category

NXP FRDM-MCXE247 Semiconductors

Description

The FRDM-MCXE247 is a feature-rich development platform for NXP's MCXE247 32-bit microcontroller, based on an Arm Cortex-M4F core running up to 112 MHz. It offers extensive connectivity and expansion options, including Ethernet, CAN PHYs, onboard debugging, and support for Arduino, Pmod, and mikroBUS ecosystems. This board is ideal for rapid prototyping and evaluation in industrial and consumer applications.

1 84 85 86 87 88 89 90 91 92 93 94 95 96 464