Samtec has introduced two new additions to its AcceleRate® HP family, the APM6 and APF6, which bring 800 positions to the platform and target high-density, high-speed system designs. Built on a 0.635 mm pitch and a 5 mm mated stack height, these connectors are designed to deliver up to 112 Gbps PAM4 performance in a compact footprint.
This combination of density and signal integrity makes the new connectors well suited for applications such as AI accelerators, high-performance computing, advanced networking equipment, and large-scale storage systems. Engineers designing next-generation systems need to move more data across boards without sacrificing space or power budget, and the 800-position arrays give them a way to do that.
Design and Electrical Features
Each connector provides eight rows of 100 positions, creating a dense footprint measuring 68.62 mm × 18.20 mm. A 10 mm version is planned for release in 2026 for systems that need additional vertical clearance. The open pin field design allows flexible signal assignment and grounding strategies, which is important for optimising high-speed routing.
Electrically, the connectors support PCIe 6.0, CX 3.2, and 100 GbE protocols. They carry up to 2 A per powered pin and are rated for 150 VAC (212 VDC). Samtec’s Solder Column Termination process is used here, which is IPC Class 3 compliant and improves mechanical robustness while maintaining excellent insertion and return loss performance over time.
Why It Matters
At 112 Gbps PAM4, even small variations in impedance or signal path can impact performance. By combining high pin counts, flexible routing, and proven solder column reliability, Samtec is giving designers a way to handle faster data rates without compromising long-term connector integrity.
Availability
The APM6 and APF6 are available now from Samtec and authorised distributors.
Learn more and read the original press release at www.samtec.com
You may also like
