STMicroelectronics
@stmicroelectronicsSTMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. With a portfolio spanning microcontrollers, sensors, power and analog devices, ST enables smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things.
Articles by STMicroelectronics
News23 Sep 2026ST Launches Dual-Accelerometer IMUs for ±320 g Event Capture
STMicroelectronics launches LSM6DSK320X and ISM6HGK256X 6-axis IMUs with dual ±16 g and ±320 g accelerometers, a vibration-resistant gyroscope and integrated machine-learning core.
Read article →
News14 Sep 2026ST Launches VD56GA 1.1 MP Image Sensor for In-Cabin Monitoring
ST launches the 1.1 MP VD56GA automotive image sensor with DeepNIR technology, improved infrared sensitivity and integrated image processing.
Read article →
News25 Jun 2026STMicroelectronics Introduces ST54M Secure Mobile Chip with Post-Quantum Cryptography
STMicroelectronics has launched the ST54M secure mobile chip, combining NFC, secure element, eSIM functionality, and a hardware accelerator for ML-KEM and ML-DSA post-quantum cryptography algorithms.
Read article →
News22 Jun 2026STMicroelectronics Launches VL53L9 3D LiDAR Module for Edge AI Systems
STMicroelectronics has launched the VL53L9 direct Time-of-Flight 3D LiDAR module featuring 2,268 sensing zones, a 54 × 42 sensing array, frame rates up to 100 fps, integrated processing, MIPI and I3C interfaces, and sensing distances from less than 5 cm to 9 m.
Read article →
News3 Jun 2026ST Vibration Sensor Adds In-Sensor AI for Condition Monitoring
STMicroelectronics has introduced the IIS3DWB10IS, a MEMS vibration sensor for industrial condition monitoring. The device combines 200g vibration measurement, bandwidth above 10kHz, ISPU 2.0 processing, embedded AI inference, and operation up to 125°C in a compact LGA package.
Read article →
News27 May 2026ST Expands 700V PowerGaN Devices For AI And Robotics
STMicroelectronics has added seven 700V PowerGaN HEMTs to its STPOWER portfolio, targeting AI servers, robotics, industrial power systems, and high-density power conversion designs with current ratings up to 29 A.
Read article →
News28 Apr 2026STMicroelectronics Targets Always-On Vision With Low-Power Image Sensors
STMicroelectronics VD55G4 and VD65G4 bring ultralow power global shutter sensing to always-on vision systems in wearables, IoT, and embedded designs.
Read article →
News17 Mar 2026STMicroelectronics Pushes 800 VDC Power Closer to AI GPUs
STMicroelectronics expands its 800 VDC power architecture with new 12V and 6V conversion stages, enabling more efficient power delivery closer to GPUs in high-density AI data center infrastructure.
Read article →
News10 Mar 2026STMicroelectronics ST64UWB Extends UWB Range for Secure Access
STMicroelectronics introduces the ST64UWB family supporting IEEE 802.15.4z and upcoming 802.15.4ab ultra-wideband standards with multi-millisecond ranging, improved link budget using 18 nm FD-SOI, and radar sensing capabilities for automotive and smart device applications.
Read article →
News9 Mar 2026STMicroelectronics Scales Silicon Photonics for AI Interconnects
STMicroelectronics moves its PIC100 silicon photonics platform into high-volume 300 mm production for 800G and 1.6T optical interconnects supporting AI data center infrastructure.
Read article →
News5 Mar 2026STMicroelectronics STM32C5 Cortex-M33 Entry-Level MCU
STMicroelectronics introduces the STM32C5 MCU family with Cortex-M33 cores, up to 1 MB Flash, security features, and a 40 nm process aimed at entry-level embedded systems and connected smart devices.
Read article →
News11 Feb 2026STMicroelectronics’ Stellar P3E MCU Brings Real-Time AI Acceleration To Automotive Edge Intelligence
STMicroelectronics’ Stellar P3E automotive MCU integrates real time AI acceleration, PCM based memory and high performance Cortex R52 plus cores to support edge intelligence, virtual sensing and software defined vehicle architectures with microsecond level inference.
Read article →