Octavo OSD335x-SM System-in-Package


Octavo OSD335x-SM System-in-Package

Manufacturer

Part #

Category

Octavo Systems OSD335x-SM Semiconductors

Description

The OSD335x-SM is a compact System-in-Package integrating a TI Sitara AM335x ARM Cortex-A8 processor, DDR3 memory, power management IC, LDO, EEPROM, and passives in a 21mm x 21mm BGA. It offers programmable I/O voltage domains, accessible low power modes, and a simplified layout for rapid design. Ideal for space-constrained ARM-based applications requiring high integration.


Introduction

The Octavo OSD335x-SM System-in-Package is a highly integrated solution designed to simplify and accelerate the development of ARM-based embedded systems. By combining multiple essential components into a single compact package, it enables engineers to create powerful, space-efficient designs with reduced complexity.

Part Description

The OSD335x-SM from Octavo Systems is a System-in-Package (SiP) that integrates a Texas Instruments Sitara AM335x ARM Cortex-A8 processor, DDR3 memory, power management IC, LDO, EEPROM, and necessary passive components—all within a 21mm x 21mm BGA footprint. This high level of integration reduces board space requirements and streamlines the design process. The SiP features programmable I/O voltage domains, supports accessible low power modes, and offers a simplified PCB layout, making it ideal for rapid prototyping and production of compact ARM-based devices.

Applications

  • Industrial automation controllers
  • Human-machine interfaces (HMI)
  • IoT gateways and edge devices
  • Portable medical devices
  • Robotics controllers
  • Smart home hubs
  • Compact single-board computers

Industries

  • Industrial automation
  • Medical devices
  • Consumer electronics
  • Robotics
  • Smart home and building automation
  • Telecommunications
  • Automotive (infotainment and telematics)

Usage Ideas

  1. Portable Data Logger:
    Build a compact, battery-powered data logger for environmental monitoring, leveraging the SiP’s low power modes and integrated memory.

  2. Custom IoT Gateway:
    Design a small-form-factor IoT gateway that connects sensors and devices to the cloud, utilizing the programmable I/O and ARM processing power.

  3. Educational Robotics Platform:
    Create a modular robotics controller for educational kits, taking advantage of the simplified layout and high integration to minimize board size and complexity.

Conclusion

The Octavo OSD335x-SM System-in-Package offers a powerful and space-saving solution for embedded system designers. By integrating key components into a single package, it reduces design time, complexity, and board space, making it an excellent choice for a wide range of applications across multiple industries. Whether for rapid prototyping or production, the OSD335x-SM enables innovative, compact, and efficient ARM-based designs.