Nexperia has launched a new line of BJTs aimed at engineers working on space-constrained, thermally demanding designs. The series, called MJPE, uses the company's clip-bonded FlatPower (CFP15B) packaging and is available in both automotive and industrial variants.
Traditional MJD-style transistors in DPAK packages take up more board space than many designs can afford. The MJPE parts offer the same performance but in a package that's 53% smaller. That change alone makes them attractive for dense, multi-layer PCBs where layout flexibility and heat handling are critical.
There are 12 transistors in the new range: six for automotive (e.g. MJPE31C-Q), and six for industrial (e.g. MJPE44H11). Each comes in NPN and PNP types, with voltage ratings of 50 V, 80 V, or 100 V, and collector currents from 2 A to 8 A.
The CFP15B package isn't just smaller, it’s also more efficient. By using copper clip bonding instead of traditional wire bonding, Nexperia has improved current flow, reduced resistance, and enhanced thermal transfer. These features are especially useful in designs like battery systems, EV chargers, or power supplies, where heat and current stress are constant issues.
The devices can also operate up to 175°C, making them suitable for use in harsh automotive conditions. And because they share the same packaging style as other Nexperia components (like Schottky diodes and recovery rectifiers), engineers can unify board layouts across multiple functions.
MJPE devices are already being considered for battery management systems (BMS), display backlighting, and on-board charging modules. They also fit well in general power switching roles where reliability and compact layout are more important than digital control features.
“Packaging is now a key part of the thermal system,” said Frank Matschullat, Product Group Manager at Nexperia. “With modern multilayer PCBs and high-performance controllers, CFP technology helps us deliver smaller devices without giving up electrical performance.”
Read the original announcement here.
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