Digi XBee® 3 BLU Brings BLE 5.4, Edge Intelligence, and Security in One Module

For many engineers, adding Bluetooth to a product means finding a module, pairing it with a microcontroller, writing firmware, and then chasing regulatory approvals. That slows development and adds extra cost to every design.

Digi International’s new XBee® 3 BLU aims to take that complexity away. It combines Bluetooth LE 5.4 connectivity, edge processing, and built-in security in a single, pre-certified module. The idea is to let teams go from concept to deployment faster, with fewer components and less time spent on integration.

Bluetooth Connectivity With Local Processing

The module supports extended range and improved throughput from the Bluetooth 5.4 spec, plus beaconing for applications like proximity detection and asset tracking. What sets it apart is the inclusion of a MicroPython runtime with direct access to digital I/O and ADC pins. For many simple devices, that means no separate MCU is required. Logic, sensor readings, and even control decisions can all run on the module itself, which saves board space and power.

Security Built In

Digi’s TrustFence security framework comes standard, including secure boot, hardware-accelerated encryption, and SRP-based authentication for zero-knowledge pairing. When combined with Bluetooth’s own encrypted advertising and secure pairing features, the result is a module that is well-suited for use in connected healthcare devices, industrial nodes, and retail sensors where security can’t be an afterthought.

Easier Deployment and Maintenance

Field work is simplified too. Digi XBee Studio helps configure modules, update firmware, and create profiles, while the Digi XBee Mobile App enables OTA updates and configuration from an iOS or Android device. For companies building their own apps, the Digi IoT Mobile SDK and .NET MAUI library provide a way to create cross-platform mobile tools from a single codebase, reducing development effort and support costs.

Industrial Ready

The XBee 3 BLU is available in through-hole and micro form factors, pre-certified for global markets, and rated for operation from -40 °C to +85 °C. That makes it drop-in ready for designs that need to withstand harsh environments without a lengthy compliance cycle.

The module and development kits are available now through Digi’s distributors.

Learn more and read the original article on www.digi.com