The latest additions to Infineon’s OptiMOS™ 7 family bring tailored solutions for engineers designing high-efficiency switching converters and robust motor-drive systems. These new devices extend the company’s well-established automotive OptiMOS 7 portfolio into the industrial and consumer space, with variants optimised for either fast switching or reliable motor control.
25 V Devices Target High-Performance Switching
The OptiMOS 7 25 V series moves away from the “one-size-fits-all” approach, offering two distinct technology options for hard- and soft-switching topologies. This allows engineers to pick the best device for their design, whether they are working on intermediate bus converters for 48 V AI power rails or switched-mode power supplies for telecom and server equipment.
Infineon reports that the hard-switching devices feature excellent Miller ratio, FOM, and RDS(on)10 performance, while the soft-switching versions deliver ultra-low RDS(on)45 and FOMQg. When compared with the previous OptiMOS 5 generation, the new parts can achieve up to 20% lower RDS(on) and as much as 25% better figures of merit, helping designers shrink losses and boost efficiency.
40 V Devices Built for Motor Drives
For motor-drive applications, the 40 V OptiMOS 7 devices introduce a much wider safe operating area, three times that of the prior generation, as well as lower RDS(on) and improved gate characteristics. These enhancements support better current sharing, reduce voltage overshoot, and deliver reliable operation under heavy switching stress.
This makes them well-suited for power tools, garden equipment, and other electrically demanding motor systems where efficiency, reliability, and thermal performance are critical design goals.
Packaging and Design Flexibility
The switching-optimised 25 V devices are available in compact source-down PQFN 3.3 × 3.3 mm packages, with bottom- and dual-side-cooling variants in a centre-gate footprint for easier PCB design. The motor-drive portfolio is offered in SuperSO8 (5 × 6 mm) and PQFN 3.3 × 3.3 mm packages, giving engineers multiple options for board layout and thermal performance.
Learn more and read the original release on www.infineon.com
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