STMicroelectronics has introduced the IIS3DWB10IS, a MEMS vibration sensor for industrial condition monitoring applications. The device combines wide-bandwidth vibration sensing with an integrated Intelligent Sensor Processing Unit (ISPU 2.0), bringing signal processing and AI inference directly into the sensor package.
The IIS3DWB10IS is a digital vibration sensor used for industrial condition monitoring systems. Typical applications include motors, pumps, fans, gearboxes, conveyors, and other industrial machinery.
200g Dynamic Range and 10kHz Bandwidth
The sensor measures vibrations and shocks up to 200g and supports frequencies above 10kHz. ST specifies a 35µg/√Hz noise floor. The device is rated for operation up to 125°C and includes an integrated temperature sensor. ST positions the IIS3DWB10IS as a digital alternative to piezoelectric sensors used for machine condition monitoring. Alongside vibration sensing, the device combines digital output, embedded processing, and a MEMS-based construction.
ISPU 2.0 Processing Architecture
A key part of the device is the second-generation Intelligent Sensor Processing Unit. ISPU 2.0 integrates dedicated hardware accelerators for signal processing and AI workloads while retaining a C-programmable architecture with on-chip program and data RAM.
The processor delivers up to 40 MIPS and 40 MFLOPS of digital signal processing performance. ST states this represents up to four times the processing capability of the previous ISPU generation. The sensor interface also supports data transfer rates up to six times faster than the earlier architecture.
Software support includes libraries for FFT analysis, filtering, envelope processing, velocity severity calculations, and anomaly detection.
Memory and Industrial Integration
The IIS3DWB10IS incorporates a 2048 × 80-bit FIFO register for local data buffering and event capture. The device is supplied in a 4.5mm × 4.5mm × 1.5mm 16-lead LGA package with wettable flanks.
ST has included the sensor in its 10-year industrial longevity program. Production availability is scheduled for July 2026, with pricing starting at $25 for orders of 1,000 units.
Download the IIS3DWB10IS datasheet
Learn more and read the original announcement at www.st.com
Technology Overview
The IIS3DWB10IS is a MEMS-based digital vibration sensor for industrial condition monitoring. It supports vibration and shock measurements up to 200g at frequencies above 10kHz and incorporates the ISPU 2.0 processing engine with 40 MIPS and 40 MFLOPS performance. The device operates at temperatures up to 125°C and includes a 2048 × 80-bit FIFO register and integrated temperature sensor.
Frequently Asked Questions
What is the IIS3DWB10IS used for?
The sensor is intended for industrial condition monitoring applications that use vibration analysis to monitor machinery.
What vibration range does the IIS3DWB10IS support?
The IIS3DWB10IS measures vibrations and shocks up to 200g and supports frequencies above 10kHz.
Does the IIS3DWB10IS include embedded processing?
Yes. The device integrates ST's ISPU 2.0 processing unit with hardware accelerators for signal processing and AI inference.
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