Cadence has expanded its AI Super Agent portfolio with AuraStack, a new platform for PCB and advanced package design built on Allegro AI Studio. The launch moves the company's AI technology beyond chip design into board and package development, supporting work from early planning through layout, analysis, and signoff within a single environment.
The software is aimed at increasingly complex electronic systems, including AI infrastructure, automotive electronics, and high-performance computing, where PCB layout, package design, and power delivery have become critical parts of overall system performance. AuraStack will be available during 2026.
AI Across the PCB Design Flow
Cadence has built AuraStack around the complete PCB and package design process rather than a single design task. The platform covers system planning, constraint management, placement and routing, advanced packaging, design-for-manufacture checks, and final signoff from within Allegro AI Studio.
Rather than using separate AI tools for different stages of development, AuraStack coordinates multiple AI agents across the workflow. Planning, implementation, and verification remain connected throughout the design process, reducing the amount of manual iteration required as projects progress.
Bringing Multiphysics Together
One of the main additions is a unified multiphysics workflow that combines electrical, thermal, and mechanical analysis within the same design environment.
Instead of treating signal integrity, power integrity, thermal performance, and mechanical behaviour as separate validation stages, AuraStack allows these analyses to run together throughout development. Cadence says this helps engineers identify design trade-offs earlier, reducing late-stage redesigns and lowering the risk of board respins.
The platform integrates with several existing Cadence analysis tools, including Celsius Thermal Solver, Clarity 3D Solver, Sigrity X Platform, and the MSC Nastran and Marc finite element analysis solvers.
Industry Collaborations
Several companies are already working with Cadence on AuraStack-based design workflows. NVIDIA is using the platform to support AI infrastructure development, while TSMC is collaborating with Cadence on AI-assisted routing for advanced package substrates. Socionext, FORVIA HELLA, and Schneider Electric are also applying the technology to PCB and package development, including automated placement, routing, and engineering workflow optimisation.
Cadence expects AuraStack AI Super Agent to become available during 2026.
Learn more and read the original announcement at the Cadence website.
Technology Overview
Cadence AuraStack AI Super Agent is an AI-assisted design platform for PCB and advanced packaging that runs on Allegro AI Studio. It combines PCB layout, package development, multiphysics analysis, and design optimisation within a single workflow, bringing together signal integrity, power integrity, thermal, and mechanical analysis throughout product development.
Frequently Asked Questions
What is Cadence AuraStack?
AuraStack is an AI-assisted design platform for PCB and advanced package development that runs on Allegro AI Studio and coordinates multiple stages of the electronic design process.
Which engineering disciplines does AuraStack combine?
The platform brings together signal integrity, power integrity, thermal analysis, and mechanical analysis within a unified multiphysics workflow.
When will AuraStack be available?
Cadence says AuraStack AI Super Agent will become available during 2026.
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