Tektronix Adds 200 V Dual-Channel SMU to MP5000 Test Platform



Uploaded image Tektronix has added the MSMU200-2 Source Measure Unit to its MP5000 Series Modular Precision Test System. The dual-channel module extends the platform to higher-voltage semiconductor characterisation, device reliability and stress testing, as well as optical and integrated device validation.

Each channel can source and measure up to 200 V and 1.5 A DC within a 30 W power envelope. For tests requiring higher current over short periods, the MSMU200-2 supports pulses up to 7 A.

The new module joins the 60 V MSMU60-2 SMU introduced last year and the dual-channel 50 W MPSU50-2ST power supply module already available for the MP5000 platform.

7 A Pulses for Higher-Current Testing

The extended pulse capability lets engineers apply higher-current test conditions in controlled bursts as short as hundreds of microseconds, depending on the source range and impedance of the device under test. Keeping these tests short can limit device self-heating that might otherwise affect the measurement or damage the device.

Integrated digitizers simultaneously sample voltage and current at up to 1 MS/s. Fast transient events and pulse waveforms can therefore be captured directly by the module without adding a separate digitizer or oscilloscope for many DC and pulse measurements.

Tektronix is targeting semiconductor device characterisation, package-level reliability testing and chip validation, including ASICs and FPGAs. The higher voltage and pulsed operation also extend the platform to optoelectronic and other integrated devices.

Checking Connections and Controlling Current

The MSMU200-2 includes a built-in Contact Check function that can verify force and sense connections before a test starts. Input overvoltage protection and an optional autosense capability are also included for protecting devices, probes and instruments during testing.

Positive and negative current limits can be programmed independently. This gives engineers separate control over sourcing and sinking current when working with devices such as power management ICs, voltage regulators and batteries.

Synchronising Tests Across Multiple Channels

Alongside the new SMU, Tektronix has introduced the TriggerFlow graphical interface within TSP Toolkit. TriggerFlow is used to build and view parallel test sequences, including when individual channels change source levels, take measurements or respond to events. Tests can also be coordinated with external equipment such as probers and handlers. Using TSP-Link, source changes across channels and connected MP5000 mainframes can be synchronised to within 500 ns.

The three-slot MP5103 mainframe can accommodate a mixture of SMU and power supply modules, with up to six channels available in a 1U rack space. Individual slots can be stopped and restarted when a module needs to be inserted, removed or replaced without shutting down the complete mainframe.

The MSMU200-2 and TriggerFlow interface are available now.

Learn more and read the original announcement at tek.com.


Technology Overview

The Tektronix MSMU200-2 is a dual-channel Source Measure Unit for the MP5000 Modular Precision Test System. It supports sourcing and measurement up to 200 V and 1.5 A DC, pulses up to 7 A and simultaneous voltage and current sampling at up to 1 MS/s.

FAQs

What voltage and current can the MSMU200-2 handle?

Each channel supports up to 200 V and 1.5 A DC within a 30 W power envelope, with pulsed current capability extending to 7 A.

How quickly can the MSMU200-2 sample measurements?

Its integrated digitizers can simultaneously sample voltage and current at rates up to 1 MS/s.

What is the MSMU200-2 designed to test?

Tektronix is targeting semiconductor characterisation, reliability and stress testing, chip validation and testing of optical and integrated devices.


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About The Author

Tektronix is a global leader in electronic test and measurement solutions, helping engineers design, validate, and troubleshoot technologies across industries including semiconductors, aerospace, automotive, communications, and computing.

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