Samtec Introduces 10 mm AcceleRate mP Connectors for High-Speed Signal and Power

Samtec has introduced a 10 mm stack-height option for its AcceleRate mP UDM6 and UDF6 board-to-board connectors, combining high-speed digital signaling and power delivery in a single connector system. The dual functionality eliminates the need for additional connectors, reducing overall PCB space in applications including data communications, 5G/6G wireless networks, industrial automation, robotics and instrumentation.

The connectors support signal transmission up to 64 Gbps PAM4 (32 Gbps NRZ), alongside high-power blades rated up to 15 A each and a voltage rating of 200 VAC or 283 VDC.

High-Speed Signals and Power Delivery

To reduce crowding in the connector and provide uniform cooling, the power blades are positioned parallel to the connector body length. This placement is a 90° shift compared with common power systems and is designed to improve heat dissipation while maintaining high current-carrying capacity.

The open-pin-field design of the high-density signal array supports single-ended signals, differential pairs and lower-speed power using pin assignments based on application requirements. Ground paths can also be placed to reduce crosstalk and control impedance.

Stack Heights and Connector Configurations

Samtec offers a variety of pin and blade options at both 5 mm and 10 mm stack heights. The open-pin-field design provides 60, 120, 180 or 240 total pins on a six-row grid, with 4, 6, 8 or 10 high-power blades available.

The AcceleRate mP UDM6 and UDF6 connectors have also undergone Samtec's Severe Environment Testing (SET), which evaluates products beyond typical industry standards for use in rugged and harsh environments.

The connectors are intended for applications including datacom, industrial automation, military and aerospace systems, and other equipment requiring signal and power connections within a compact PCB footprint.

Learn more and read the original announcement at samtec.com.

Technology Overview

The Samtec AcceleRate mP UDM6 and UDF6 are high-density board-to-board connectors combining high-speed signal contacts and power blades in a single interconnect. The new 10 mm stack-height option supports signal transmission up to 64 Gbps PAM4 (32 Gbps NRZ), with power blades rated up to 15 A each and a voltage rating of 200 VAC or 283 VDC. Configurations include 60 to 240 signal contacts and 4 to 10 power blades, with open-pin-field routing and Samtec Severe Environment Testing.

FAQs

What signal speeds do Samtec AcceleRate mP connectors support?

The UDM6 and UDF6 connectors support signal transmission up to 64 Gbps PAM4 or 32 Gbps NRZ, with an open-pin-field arrangement for single-ended and differential-pair signaling.

How much power can the AcceleRate mP connectors carry?

The power blades are rated for up to 15 A each, with a voltage rating of 200 VAC or 283 VDC. Available configurations include 4, 6, 8 or 10 power blades.

What stack heights and pin configurations are available?

The AcceleRate mP connectors are offered in 5 mm and 10 mm stack heights, with 60, 120, 180 or 240 signal contacts arranged on a six-row grid.