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Toshiba Adds Complementary Dual MOSFET For Motor Control And Load Switching

Toshiba has introduced the SSM6L826R, a 30 V complementary dual MOSFET that combines N-channel and P-channel devices in a TSOP6F package for motor control and load-switching applications in consumer and industrial equipment.

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EPC Demonstrates 800 V To 12.5 V AI Power Converter Without 48 V Stage

EPC's EPC91123 evaluation board converts 800 VDC directly to 12.5 VDC at up to 6 kW, achieving 98.2% efficiency while eliminating the need for a 48 V intermediate stage.

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Huawei Unveils Plans for 1.4nm Devices

As the US continues to try and limit China’s technological capabilities, Huawei has recently revealed their plans to achieve 1.4nm chips, something that would negate all US efforts. What challenges does China face in creating smaller transistors, what did Huawei announce, and why could this be the end of US capabilities in limiting Chinese engineers?

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Researchers Stack Active Chip Layers To Increase Transistor Count

As researchers approach the fundamental limits of transistor design, some are now looking to go up rather than down. What challenges does chip stacking face, what have researchers recently demonstrated, and why is this the future of semiconductor technologies?

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Infineon Raises SiC Module Temperature Limit To 205°C For EV Inverters

Infineon has introduced the FS01M9R13A7MA2B, a 1300 V HybridPACK Drive silicon carbide power module supporting continuous 205°C operation and up to 15% higher output current for EV traction inverters.

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Diodes Combines USB PD3.1 And Buck Control In Automotive USB-C IC

Diodes has introduced the APK43070Q, an automotive-qualified USB PD3.1 controller with integrated buck conversion, 140 W charging support, and intelligent power sharing across up to eight USB-C ports.

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Qorvo Expands RF Switching Portfolio With Wideband 10 GHz Family

Qorvo has introduced the QPC6144, QPC6122, and QPC6188 RF switches, delivering wideband operation from 50 MHz to 10 GHz with high isolation and simplified RF routing for 5G, industrial, drone, and test systems.

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TDK Adds Dual-Output 3D Hall Sensors For Motor Direction Detection

TDK has introduced the Micronas HAL 13xy family, a dual-output 3D Hall-effect switch sensor for automotive and industrial motor control with quadrature outputs, ASIL B readiness, and operation up to 170 °C.

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Microchip Targets Solid-State Transformers With 3.3 kV SiC Modules

Microchip has introduced 3.3 kV HV-D3 mSiC power modules for solid-state transformers, combining SiC MOSFETs, Schottky diodes, and high-voltage isolation for AI data centers and medium-voltage power systems.

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u-blox Adds Edge ML To ALMA-B2 Bluetooth LE Modules

u-blox has launched the ALMA-B2 wireless module series based on Nordic Semiconductor’s nRF54LM20 platform, combining Bluetooth LE 6.0, Thread, Zigbee, Channel Sounding, and Edge ML acceleration in compact IoT modules.

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Toshiba Adds Complementary Dual MOSFET For Motor Control And Load Switching

EPC Demonstrates 800 V To 12.5 V AI Power Converter Without 48 V Stage

Huawei Unveils Plans for 1.4nm Devices

Researchers Stack Active Chip Layers To Increase Transistor Count

Infineon Raises SiC Module Temperature Limit To 205°C For EV Inverters

Diodes Combines USB PD3.1 And Buck Control In Automotive USB-C IC

Qorvo Expands RF Switching Portfolio With Wideband 10 GHz Family

TDK Adds Dual-Output 3D Hall Sensors For Motor Direction Detection

Microchip Targets Solid-State Transformers With 3.3 kV SiC Modules

u-blox Adds Edge ML To ALMA-B2 Bluetooth LE Modules

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