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Filtering by tag: "Molex"

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Molex Impress Moves 224G Links Onto the ASIC Substrate

Molex launches Impress Co-Packaged Copper, a compression-attached substrate connector delivering 224G PAM-4 near-ASIC connectivity to reduce PCB loss and support next-generation AI and hyperscale data center architectures.

Molex, Impress Co-Packaged Copper, co-packaged optics, co-packaged copper, 224G PAM-4, near ASIC connectivity, high-speed interconnect, data center networking, AI accelerators, hyperscale architecture, substrate connector, compression connector, SerDes, 3.2T networking, signal integrity, PCB loss reduction, high-density server design

Molex Cardinal Assemblies Extend Coaxial Testing Into 145 GHz

Molex’s 145 GHz Cardinal multi port coaxial assemblies enable phase matched, low loss connections for next generation AI, 5G and 6G research, offering repeatable high density testing and data characterization up to 448 Gbps.

Molex, Cardinal assemblies, 145GHz testing, high frequency coax, mmWave, 6G research, AI hardware validation, satellite communications, radar systems, coaxial connectors, test and measurement, phase matched assemblies, high data rate test, RF characterization, wideband signal integrity

DigiKey Launches Engineering Unlocked Video Series

DigiKey has launched Engineering Unlocked, a three-part video series sponsored by Microchip and Molex covering prototyping, tools, and STEM.

DigiKey, Engineering Unlocked, electronics design, rapid prototyping, hardware development, development boards, engineering workflows, Supercon, maker community, open hardware, SparkFun, Arduino, Microchip, Molex, STEM education, makerspaces

Molex Impress Moves 224G Links Onto the ASIC Substrate

Molex Cardinal Assemblies Extend Coaxial Testing Into 145 GHz

DigiKey Launches Engineering Unlocked Video Series

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