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Microchip Power Module Lifts AI Server Density With Vertical Architecture

Microchip’s MCPF1525 power module provides 25A per device, stackable to 200A, with PMBus control, low noise performance and a vertical package that improves board density for AI, HPC and PCIe based compute systems.

Microchip, MCPF1525, power module, DC DC converter, vertical power module, 25A converter, stackable power, PMBus control, I2C control, AI servers, HPC power, PCIe switch power, low noise inductor, high density power design, data center electronics, embedded EEPROM, thermal management

Microchip Power Module Lifts AI Server Density With Vertical Architecture

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