AI servers carry far more components than traditional systems, with boards packed tightly with GPUs, memory devices, and power controllers. Each rack can require thousands of capacitors to manage power and signal integrity, yet available PCB space near these chips is shrinking. On top of that, thermal loads climb sharply when dozens of processors are clustered together. Engineers are left needing capacitors that combine small footprints, high capacitance, and strong stability at elevated temperatures.
Samsung Electro-Mechanics has developed the CL03X475MS3CNW#, a multi-layer ceramic capacitor that brings 4.7 µF into a 0201-inch package measuring only 0.60 × 0.30 × 0.30 mm. Rated at 2.5 V and built on an X6S dielectric, the device maintains capacitance across a wide thermal range while keeping leakage current low.
Its thickness of 0.33 mm allows two mounting options: integration into the package substrate itself or placement on the land side of the PCB. Both approaches minimise line lengths, reduce parasitic elements, and improve thermal balance around the GPU or ASIC.
Reliability and Manufacturing
The X6S material ensures capacitance stays within tolerance between –55 °C and 105 °C, a key factor for servers operating continuously under load. Reliability testing highlights stable insulation resistance and low dissipation factors even after prolonged exposure to heat and humidity. For production, the parts ship on reels in standard tape formats to slot straight into automated assembly lines.
Why It Matters
For designers of AI infrastructure, every square millimetre on the board counts. By delivering high capacitance in a 0201 body, Samsung’s new MLCC helps overcome space and heat constraints in high-density compute systems. As AI servers continue to scale, these advances in passive components become just as important as innovations in processors and memory.
Read the original announcement here.
Image credit: Samsung Electro-Mechanics
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