Renesas Electronics has introduced its third-generation DDR5 Multiplexed Rank Dual In-Line Memory Module (MRDIMM) chipset, delivering server-class memory speeds of up to 16,000 MT/s. The new chipset includes the RRG5013 Multiplexed Registering Clock Driver (MRCD) and RRG5103 Multiplexed Data Buffer (MDB), providing a 25% increase in memory bandwidth over the company's previous generation while remaining compatible with existing DDR5 server infrastructure.
The Gen 3 chipset is intended for next-generation servers supporting AI, cloud computing and high-performance computing (HPC), where increasing memory throughput is becoming as important as processor performance.
Higher Memory Bandwidth Without Platform Changes
Rather than requiring a new memory architecture, Renesas has designed its Gen 3 MRDIMM solution to work within existing DDR5 server platforms. This allows system designers to increase memory bandwidth while preserving established DIMM form factors and platform compatibility. Compared with Renesas' second-generation MRDIMM devices, the new chipset delivers 25% higher bandwidth, allowing server platforms to transfer larger volumes of data without significant architectural changes.
The chipset forms part of Renesas' wider MRDIMM platform, which also includes power management ICs (PMICs), Serial Presence Detect (SPD) hubs and temperature sensors. Together, these components provide a complete memory interface solution that can be scaled across multiple MRDIMM generations.
Improved Training and System Visibility
The Gen 3 chipset also introduces Device Equalization Self-Train Mode (DESTM) Quality Indication Status, giving system designers greater visibility during receiver equalisation and timing training. The feature allows memory subsystems to be tuned more precisely, helping maximise signal margins as operating speeds continue to increase.
Renesas says the new chipset has also been developed with system-level power efficiency in mind, helping manage thermal and power constraints alongside higher memory bandwidth.
The RRG5013 MRCD and RRG5103 MDB devices are currently sampling to major DRAM manufacturers and selected customers, with production expected during the second half of 2027.
Learn more and read the original announcement at the Renesas website.
Technology Overview
MRDIMM (Multiplexed Rank Dual In-Line Memory Module) is an evolution of DDR5 server memory that increases memory bandwidth by multiplexing data transfers between memory ranks. This allows higher throughput while maintaining compatibility with standard server memory interfaces and DIMM form factors.
Frequently Asked Questions
What is new about Renesas' Gen 3 MRDIMM chipset?
The new chipset delivers DDR5 MRDIMM performance of up to 16,000 MT/s, providing 25% more memory bandwidth than the previous generation while maintaining compatibility with existing DDR5 server platforms.
Which devices make up the chipset?
The chipset consists of the RRG5013 Multiplexed Registering Clock Driver (MRCD) and the RRG5103 Multiplexed Data Buffer (MDB).
When will the chipset be available?
Engineering samples are available now to selected customers and major DRAM suppliers, with production expected during the second half of 2027.
You may also like
