Renesas
@renesasRenesas Electronics Corporation delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices. Their wide-ranging portfolio spans MCUs, SoCs, analog, power, and wide-bandgap devices, serving automotive, industrial, and infrastructure markets worldwide.
Articles by Renesas
Renesas Launches 650 V GaN FET in 8 × 8 mm Dual-Side-Cooled Package
Renesas launches the TP65H020G4PLSGBD 650 V GaN FET with 20 mΩ on-resistance in an 8 × 8 mm dual-side-cooled PQFN package for high-density 800 V power conversion.
Read article →Renesas Launches 1.155 mm GreenPAK IC with In-System Reconfiguration
Renesas launches the SLG46801 configurable mixed-signal GreenPAK IC in a 1.155 × 1.155 mm WLCSP, with multi-time programming, I²C configuration and 1.71 V to 5.5 V operation.
Read article →Renesas Launches RZ/G3L and RZ/G3SE MPUs for HMI and IoT Edge Systems
Renesas launches RZ/G3L and RZ/G3SE MPUs with Cortex-A55 processing, 1 mW-level Linux standby, PCIe and TSN for HMI and IoT edge systems.
Read article →Renesas Introduces Gen 3 DDR5 MRDIMM Chipset with 16,000 MT/s Performance
Renesas has introduced its Gen 3 DDR5 MRDIMM chipset, delivering up to 16,000 MT/s memory performance while maintaining compatibility with existing DDR5 server infrastructure.
Read article →Renesas Unveils Bidirectional 650 V GaN Switch For Simpler Power Stages
Renesas has launched the TP65B110HRU, a 650 V-class bidirectional GaN switch that blocks current in both directions in one device, helping simplify solar microinverters, AI data center power systems, and onboard EV chargers.
Read article →Renesas GaN Charging Topology Pushes Compact Power Higher
Renesas has expanded its AC/DC charging portfolio with a GaN-based half-wave LLC platform built around the RRW11011 and companion controllers, targeting compact 100 W to 500 W plus chargers with 5 V to 48 V output capability.
Read article →Renesas RH850/U2C MCU Targets Zoned Automotive Control
Renesas introduces the RH850/U2C automotive MCU built on 28nm technology with four cores, ASIL D functional safety, Ethernet TSN, CAN-XL connectivity and hardware cryptography for next-generation vehicle E/E architectures.
Read article →Renesas Chiplet SoC Tech for Automotive SDV ECUs
Renesas develops automotive SoC technologies for SDV-era multi-domain ECUs, combining chiplet safety across UCIe, expanded AI NPUs, and advanced multi-domain power control.
Read article →Renesas 3nm TCAM Architecture Targets Automotive SoCs
Renesas introduces a 3nm FinFET TCAM architecture achieving 5.27 Mb/mm² density, 0.167 fJ per bit search energy, and enhanced functional safety for automotive SoCs, presented at ISSCC 2026.
Read article →Renesas R-Car X5H Targets Multi-Domain SDV Compute at 3nm
Renesas R-Car X5H brings 3 nm multi-domain compute, AI acceleration and SDV-ready software support for next-generation vehicles.
Read article →Renesas RA6W1 and RA6W2 Bring Wi Fi 6 to Ultra Low Power IoT
Dual band Wi Fi 6 MCUs offer ultra low power connectivity for always on IoT systems.
Read article →Renesas Pushes DDR5 RDIMM Speeds to 9600 MT/s with Gen6 RCD
Renesas’ sixth-generation DDR5 Registered Clock Driver achieves 9600 MT/s with expanded equalization, built-in telemetry, and backward compatibility for AI and HPC platforms.
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