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EPC Introduces 23 mm GaN Inverter for Robots and Drones

EPC has introduced the EPC91132, a 23 mm diameter GaN-based BLDC motor drive inverter for drones and humanoid robots. Built around the EPC33110 power module, the design delivers 11 ARMS continuous current at 48 V and supports PWM frequencies up to 100 kHz.

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u-blox Adds Edge ML To ALMA-B2 Bluetooth LE Modules

u-blox has launched the ALMA-B2 wireless module series based on Nordic Semiconductor’s nRF54LM20 platform, combining Bluetooth LE 6.0, Thread, Zigbee, Channel Sounding, and Edge ML acceleration in compact IoT modules.

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TDK Expands Micro POL Modules for AI Edge Power Rails

TDK has introduced the FS3303 micro POL power module for AI edge systems and optical networking hardware, delivering 3 A in a 2.5 mm × 2.5 mm package with integrated power components.

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Toshiba Adds 80V MOSFETs For 48V Automotive Systems

Toshiba has introduced the XPH2R608QB and XPH3R908QB, two AEC-Q101 compliant 80V N-channel MOSFETs for 48V automotive systems, BLDC motor drives, buck converters, and load switches.

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CPU Shortage Could Soon Ease With Intel’s 18A Process

The global CPU shortage, driven by surging AI demand and high DRAM prices, has made CPUs harder to find than memory, with both Intel and AMD struggling to meet market needs. Intel’s upcoming 18A process and Panther Lake CPUs offer hope for relief, but challenges remain. Will Intel’s 18A process truly resolve the shortage, how long until markets stabilize, and could consumer-focused startups offer new solutions?

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Bel RCM500E Railway Converter Shrinks 500 W DC-DC Power

Bel Fuse has launched the RCM500E, a compact 500 W railway DC-DC converter for 72 V and 110 V battery systems, delivering 24 V output, low inrush current, EN 50155 compliance, and built-in protection for rolling stock power designs.

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TDK Noise Filter Targets Audio Lines Without the Usual Tradeoff

TDK’s MAF0603GWY series targets RF noise on audio lines in phones and wearables, combining strong attenuation above 5 GHz with lower distortion and lower resistance than conventional chip-bead approaches.

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EPC91122 from EPC Puts GaN Motor Drive Inverter Inside Robotic Joints

EPC’s EPC91122 integrates a complete 3 phase BLDC motor drive inverter inside a compact circular form factor for humanoid joints, combining GaN switching, onboard control, sensing, and communication to deliver high current in limited space.

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Samsung HBM4 Ships At 11.7Gbps And 3.3TB/s Per Stack

Samsung begins mass production of HBM4 delivering 11.7Gbps per pin and up to 3.3TB/s per stack with 4nm logic base die, 2,048 I/Os, and improved power efficiency for AI datacenters.

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RECOM’s RPMVH Buck Modules Bring High Voltage Flexibility To Compact Designs

RECOM’s RPMVH 0.5 A buck modules support inputs up to 115 VDC and deliver regulated low voltage rails with strong thermal stability and Class B EMI performance, making them suitable for harsh industrial and high voltage environments.

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