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Filtering by tag: "AI accelerator"

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Infineon TLVR Power Module Pushes Current Density Past 2 A/mm²

Infineon’s TDM24745T quad-phase TLVR power module delivers over 2 A/mm² current density and up to 320 A peak current for AI accelerators, GPUs, and dense server power architectures where transient response and board space are under pressure.

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Infineon, TDM24745T, OptiMOS, TLVR, trans-inductor voltage regulator, quad-phase power module, AI data center, AI accelerator, GPU power delivery, server power, core rail, multiphase controller, OptiMOS 6, power density, current density, transient response, decoupling capacitors, vertical power delivery, lateral power delivery, data center power

SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

SK hynix has introduced its iHBM thermal solution for next-generation HBM memory, embedding integrated cooling elements directly into the package to reduce thermal resistance by 30 percent in AI accelerator systems.

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SK hynix, iHBM, HBM, HBM5, AI memory, high bandwidth memory, thermal management, AI accelerator, GPU memory, HPC, data center, semiconductor packaging, MR-MUF, wafer level packaging, memory cooling, D2D PHY, AI infrastructure, advanced packaging, memory technology
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