Latest News

The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

Not A Member? Join The Club Now!

Filtering by tag: "QDPAK"

Clear tag filter

Nexperia Brings QDPAK Packaging to 1200 V SiC MOSFETs

Nexperia has introduced 1200 V SiC MOSFETs in QDPAK top-side cooled packaging. The portfolio includes 17 mΩ to 80 mΩ variants, delivers up to 3 kW higher output power than D2PAK-7 devices, and targets EV, industrial, renewable energy, and datacenter power systems.

Nexperia, SiC MOSFET, Silicon Carbide, QDPAK, Top Side Cooling, Wide Bandgap, Power Electronics, EV Charger, DC-DC Converter, Photovoltaic Inverter, UPS, Motor Drive, Datacenter Power, Automotive Power, Industrial Power, Kelvin Source, 1200V MOSFET

Toshiba Targets AI Data Center Power Stages With 1200V SiC MOSFET

Toshiba has started test-sample shipments of the TW007D120E, a 1200V trench-gate SiC MOSFET in a top-side cooled QDPAK package for AI data center power supplies and 800V HVDC architectures.

Toshiba, TW007D120E, SiC MOSFET, silicon carbide, trench-gate MOSFET, AI data center, HVDC, 800V HVDC, power conversion, QDPAK, top-side cooling, power semiconductors, UPS systems, EV charging, photovoltaic inverter, energy storage, server power supply, high voltage MOSFET, data center power

Nexperia Brings QDPAK Packaging to 1200 V SiC MOSFETs

Toshiba Targets AI Data Center Power Stages With 1200V SiC MOSFET

Latest News

Information

Manage

Enquire