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Filtering by tag: "Thermal Management"

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Navitas Introduces Isolated TO-247 Package for SiC MOSFETs

Navitas has launched the UHV-TO-247-4-ISO package for 1200 V, 2300 V, and 3300 V GeneSiC MOSFETs. The package combines integrated 6000 V isolation with direct-cooled thermal management, reducing thermal resistance by up to 60% and increasing power dissipation capability by up to 150%.

Navitas, GeneSiC, SiC MOSFET, Silicon Carbide, TO-247, UHV-TO-247-4-ISO, Power Electronics, Battery Energy Storage, Solid State Transformer, Renewable Energy, Power Conversion System, Thermal Management, High Voltage Isolation, AI Datacenter Power, AMB Substrate, Aluminum Nitride

Infineon Raises SiC Module Temperature Limit To 205°C For EV Inverters

Infineon has introduced the FS01M9R13A7MA2B, a 1300 V HybridPACK Drive silicon carbide power module supporting continuous 205°C operation and up to 15% higher output current for EV traction inverters.

Toshiba’s New MOSFETs Use Advanced Packaging to Cut Losses and Boost Efficiency

Toshiba launches new MOSFETs in SOP Advance(E) package, reducing RDS(on) and thermal resistance for efficient SMPS performance.

Toshiba, MOSFET, Power Electronics, Thermal Management, Switching Regulators, Power Supplies, SMPS, Data Centres, Industrial Equipment, Base Stations, High Current, High Voltage, Transistors, Packaging Technology

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