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TDK Expands Micro POL Modules for AI Edge Power Rails

TDK has introduced the FS3303 micro POL power module for AI edge systems and optical networking hardware, delivering 3 A in a 2.5 mm × 2.5 mm package with integrated power components.

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TDK, FS3303, Micro POL, Point of Load, DC-DC Converter, Power Module, AI Edge, Optical Networking, Power Management, ASIC Power, SoC Power, DSP Power, AI Accelerators, Embedded Power, Power Electronics, POL Converter, Optical Modules, Non-Isolated Converter, Chip Embedded Packaging, Edge Computing
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