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Toshiba’s New MOSFETs Use Advanced Packaging to Cut Losses and Boost Efficiency

Toshiba launches new MOSFETs in SOP Advance(E) package, reducing RDS(on) and thermal resistance for efficient SMPS performance.

Toshiba, MOSFET, Power Electronics, Thermal Management, Switching Regulators, Power Supplies, SMPS, Data Centres, Industrial Equipment, Base Stations, High Current, High Voltage, Transistors, Packaging Technology

Toshiba’s New MOSFETs Use Advanced Packaging to Cut Losses and Boost Efficiency

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