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Infineon Raises SiC Module Temperature Limit To 205°C For EV Inverters

Infineon has introduced the FS01M9R13A7MA2B, a 1300 V HybridPACK Drive silicon carbide power module supporting continuous 205°C operation and up to 15% higher output current for EV traction inverters.

Infineon, HybridPACK Drive, FS01M9R13A7MA2B, Silicon Carbide, SiC, Power Module, EV Inverter, Traction Inverter, Electric Vehicle, 1300 V, High Voltage, Automotive Power Electronics, Power Density, Thermal Management, Automotive SiC, Vehicle Electrification, Inverter Design, High Temperature Electronics, HybridPACK, Automotive Power

Microchip Targets Solid-State Transformers With 3.3 kV SiC Modules

Microchip has introduced 3.3 kV HV-D3 mSiC power modules for solid-state transformers, combining SiC MOSFETs, Schottky diodes, and high-voltage isolation for AI data centers and medium-voltage power systems.

Microchip, Silicon Carbide, SiC, mSiC, HV-D3, Power Modules, Solid-State Transformers, SST, AI Data Centers, Medium Voltage, SiC MOSFET, Schottky Diodes, Power Conversion, Industrial Power, EV Charging, Motor Drives, Rail Power, High Voltage, Power Electronics, Data Center Infrastructure

Navitas Pushes 800 VDC Directly to 6 V in AI Power

Navitas introduces an 800 VDC to 6 V power delivery board that removes the intermediate bus stage, enabling direct high-voltage to low-voltage conversion for AI data center power systems.

Navitas, NVIDIA, AI Data Centers, 800VDC, Power Conversion, GPU Power Delivery, HVDC, Data Center Power, DC-DC Converter, GaN Power, Power Architecture, AI Infrastructure, High Voltage, Server Design, Power Density

TI 800 VDC Power Architecture Reduces Conversion Stages

Texas Instruments introduces an 800 VDC power architecture aligned with NVIDIA that reduces AI data center power delivery to two stages, removing intermediate rails and shifting constraints toward high-density local conversion.

Texas Instruments, NVIDIA, AI Data Centers, 800VDC, Power Conversion, GPU Power Delivery, HVDC, Data Center Power, DC-DC Conversion, Power Architecture, AI Infrastructure, GaN Power, Multiphase Buck, High Voltage, Server Design

onsemi and NVIDIA Collaborate on 800V DC Power Architecture for AI Data Centres

onsemi partners with NVIDIA to support 800V DC architectures, enabling high-efficiency, high-density power delivery across next-gen AI data centre infrastructure.

onsemi, NVIDIA, Power Management, Data Centres, 800V DC, SiC, Silicon Carbide, AI Infrastructure, High Voltage, Power Conversion, Intelligent Power, Solid State Transformers, AC/DC Conversion

Toshiba’s New MOSFETs Use Advanced Packaging to Cut Losses and Boost Efficiency

Toshiba launches new MOSFETs in SOP Advance(E) package, reducing RDS(on) and thermal resistance for efficient SMPS performance.

Toshiba, MOSFET, Power Electronics, Thermal Management, Switching Regulators, Power Supplies, SMPS, Data Centres, Industrial Equipment, Base Stations, High Current, High Voltage, Transistors, Packaging Technology

Diodes DPC851 Photocouplers Offer 350V Isolation for Appliances and Power Systems

Compact 350V photocouplers from Diodes offer 5kV isolation, multiple package types, and certified performance for HVAC, power, and motor control.

Diodes Incorporated, Photocouplers, Isolation Devices, Optoelectronics, High Voltage, Motor Inverters, HVAC, LED Drivers, EV Charging, Embedded Design

Infineon Raises SiC Module Temperature Limit To 205°C For EV Inverters

Microchip Targets Solid-State Transformers With 3.3 kV SiC Modules

Navitas Pushes 800 VDC Directly to 6 V in AI Power

TI 800 VDC Power Architecture Reduces Conversion Stages

onsemi and NVIDIA Collaborate on 800V DC Power Architecture for AI Data Centres

Toshiba’s New MOSFETs Use Advanced Packaging to Cut Losses and Boost Efficiency

Diodes DPC851 Photocouplers Offer 350V Isolation for Appliances and Power Systems

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