Microchip DualPack 3 IGBT7 Modules Boost Power Density and Simplify Design

Engineers designing high-power converters often find themselves trading off efficiency, thermal performance, and system complexity. A jump in power output can mean moving to a bigger frame size, adding more modules in parallel, and dealing with the additional thermal and layout challenges that come with it.

Microchip’s new DualPack 3 (DP3) modules are meant to make that jump less painful. The company has introduced six variants rated at 1200 V and 1700 V, with current ratings from 300 A up to 900 A. Built on IGBT7 technology, they promise 15–20 percent lower conduction and switching losses than earlier IGBT4 devices and can run at junction temperatures up to 175 °C during overload. For designers, that margin means smaller cooling systems and fewer compromises when pushing for higher power density.

Compact Footprint, Fewer Paralleled Modules

Each DP3 device comes in a 152 × 62 × 20 mm phase-leg package that lets engineers increase output power without stepping up to a larger frame size. Eliminating the need to parallel modules simplifies the layout, trims the bill of materials, and can improve reliability. Microchip also points out that the DP3 footprint is a second-source option for industry-standard EconoDUAL™ packages, which gives buyers more flexibility and strengthens supply chain resilience.

Built for Demanding Applications

The new modules are aimed at a broad set of markets, from industrial motor drives and renewable energy inverters to traction, energy storage, and agricultural vehicles. Improved dv/dt control and softer diode behaviour reduce EMI stress, especially in systems with long cabling. The ability to ride through overload conditions without derating helps when equipment faces real-world surges or heavy start-up loads.

A Complete System Solution

Microchip highlights that the DP3 modules can be paired with its microcontrollers, processors, and connectivity devices as part of a complete power solution. For engineering teams, this can shorten development cycles and get new drives or inverters to market faster while meeting performance and cost goals.

The DualPack 3 IGBT7 modules are now available in production quantities. For designers working on next-generation drives, renewable systems, or traction platforms, they offer a practical path to higher efficiency, a smaller footprint, and simpler system integration.

Learn more and read the original article on www.microchip.com