Toshiba Introduces 40V Automotive MOSFETs in SOP Advance(EWF) Package

Uploaded image Toshiba Electronics Europe has introduced three 40V N-channel power MOSFETs for automotive applications: XPMR5904PB, XPMR7404PB, and XPMR8504PB. The devices use the company's new SOP Advance(EWF) package and are intended for applications including inverters, semiconductor relays, load switches, and motor drives.

The the XPMR5904PB, XPMR7404PB, and XPMR8504PB are automotive-grade N-channel MOSFETs designed for high-current switching applications. The series combines Toshiba's latest package structure with a source-coupled design intended to increase current handling capability and improve thermal performance.

SOP Advance(EWF) Package Structure

The new devices adopt Toshiba's SOP Advance(EWF) package, which replaces the internal post structure commonly used in power packages with a copper clip connection between the silicon die and external leads. According to Toshiba, removing the internal posts reduces resistance in the current path. The package also incorporates a source-coupled structure that connects source terminals on the underside of the package. This arrangement increases the contact area between the package and PCB land pattern while allowing a larger chip mounting area within the package.

Drain Current up to 180A

Toshiba specifies a continuous drain current rating of 180A for the XPMR5904PB. The company states that this represents approximately 1.2 times the current capability of comparable devices that use the earlier SOP Advance(WF) package structure.

The MOSFETs are intended for automotive power systems that require high-current switching and low conduction losses.

Lower On-Resistance and Thermal Impedance

Compared with Toshiba's existing XPHR7904PS, the XPMR5904PB delivers approximately 25% lower drain-source on-resistance RDS(ON). The company also specifies an approximately 38% reduction in channel-to-case thermal impedance, Zth(ch-c). These figures are achieved through the combination of the revised package structure and source-coupled design.

Wettable Flanks for Automated Inspection

The SOP Advance(EWF) package incorporates a wettable flank structure for surface-mount assembly. The visible solder fillet produced by the package supports automated optical inspection during manufacturing. The devices are designed to meet the requirements of the AEC-Q101 automotive reliability standard.

The XPMR5904PB is available now, while the XPMR7404PB and XPMR8504PB are scheduled to become available shortly.

Learn more at www.toshiba.semicon-storage.com

Technology Overview

The XPMR5904PB, XPMR7404PB, and XPMR8504PB are 40V N-channel automotive MOSFETs built using Toshiba's SOP Advance(EWF) package. The package uses a copper clip connection and source-coupled structure to support drain current ratings up to 180A while reducing on-resistance and thermal impedance.

Frequently Asked Questions

What voltage rating do the new Toshiba MOSFETs support?

The XPMR5904PB, XPMR7404PB, and XPMR8504PB are rated for 40V operation.

What applications are the MOSFETs intended for?

The devices are designed for automotive applications including inverters, semiconductor relays, load switches, and motor drives.

What is different about the SOP Advance(EWF) package?

The package uses a post-less copper clip structure and a source-coupled design to increase current capability and improve thermal performance.

Toshiba

Toshiba Electronics Europe GmbH is the European electronic components business of Toshiba Electronic Devices and Storage Corporation. The company offers a broad portfolio of innovative semiconductor and storage solutions, including power devices, logic ICs, optoelectronics, and custom SoCs. Toshiba is committed to advancing energy efficiency, miniaturisation, and high-reliability technologies that power everything from industrial automation to next-generation communications infrastructure.