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RECOM AC/DC Module Pushes 65 W Into Less Space

RECOM’s RACM65S-K/277 is a compact 65 W AC/DC power module with 85 VAC to 305 VAC input, over 90% peak efficiency, multiple fixed outputs, and approvals for industrial, medical, and household applications.

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TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.

TE Connectivity, MezzaWave, 56G connectors, 56 Gbps PAM4, cable assemblies, high-speed connectors, board-to-board connectors, open-pin-field array, edge AI, data centers, industrial automation, robotics, aerospace and defense, VITA 57.1, VITA 57.4, FMC, FMC+, ANSI, BGA, signal integrity, mezzanine connectors

Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Alpha and Omega Semiconductor has introduced the AONC40202 and AONC68816 MOSFETs in DFN 3.3 x 3.3 double-sided cooling source-down packages for AI server Intermediate Bus Converter applications.

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Navitas Pushes 800 VDC Directly to 6 V in AI Power

Navitas introduces an 800 VDC to 6 V power delivery board that removes the intermediate bus stage, enabling direct high-voltage to low-voltage conversion for AI data center power systems.

Navitas, NVIDIA, AI Data Centers, 800VDC, Power Conversion, GPU Power Delivery, HVDC, Data Center Power, DC-DC Converter, GaN Power, Power Architecture, AI Infrastructure, High Voltage, Server Design, Power Density

TI 800 VDC Power Architecture Reduces Conversion Stages

Texas Instruments introduces an 800 VDC power architecture aligned with NVIDIA that reduces AI data center power delivery to two stages, removing intermediate rails and shifting constraints toward high-density local conversion.

Texas Instruments, NVIDIA, AI Data Centers, 800VDC, Power Conversion, GPU Power Delivery, HVDC, Data Center Power, DC-DC Conversion, Power Architecture, AI Infrastructure, GaN Power, Multiphase Buck, High Voltage, Server Design

STMicroelectronics Pushes 800 VDC Power Closer to AI GPUs

STMicroelectronics expands its 800 VDC power architecture with new 12V and 6V conversion stages, enabling more efficient power delivery closer to GPUs in high-density AI data center infrastructure.

STMicroelectronics, 800 VDC, data center power, AI infrastructure, GPU power delivery, high voltage distribution, DC power conversion, power architecture, server power design, GaN power, SiC power, power electronics, data center efficiency, GPU servers, power density

NXP and NVIDIA Target Real-Time Data Flow in Robots

NXP and NVIDIA introduce a robotics architecture using Holoscan Sensor Bridge to enable real-time data transport, sensor fusion, and synchronized motor control in humanoid and edge AI systems.

NXP, NVIDIA, Holoscan Sensor Bridge, robotics architecture, humanoid robots, edge AI, sensor fusion, real-time systems, time-sensitive networking, TSN, machine vision, motor control, embedded processors, distributed systems, robotics networking

EPC’s EPC91202 GaN Inverter Board Pushes BLDC Drives to 150 kHz

EPC’s EPC91202 GaN inverter evaluation board delivers up to 50 ARMS phase current and 150 kHz PWM switching for high-density BLDC motor drive development in robotics, drones, and e-mobility systems.

Efficient Power Conversion, EPC, EPC91202, EPC2361, eGaN FET, gallium nitride power devices, GaN motor drives, BLDC inverter, three phase inverter, motor control electronics, robotics motor drives, drone propulsion electronics, eMobility motor drives, field oriented control, space vector PWM, power electronics

Nanopower nPZero IC Changes How IoT Sensors Use Energy

Nanopower’s nPZero power-saving IC allows IoT devices to monitor up to four sensors while the host MCU remains powered down, reducing system energy consumption and enabling longer battery life in remote sensing applications.

Nanopower Semiconductor, nPZero, power saving IC, PSIC, IoT power management, sensor monitoring IC, ultra low power electronics, energy harvesting IoT, IoT battery optimization, embedded power control, event driven sensing, industrial IoT sensors, asset tracking electronics, smart agriculture monitoring, low power system design

Telit Dual-Band GNSS Modules Improve IoT Positioning

Telit Cinterion introduces SE873K5-D and SE869eK5-DRK GNSS modules with dual-band L1+L5 reception, RTK positioning and dead reckoning for reliable IoT navigation in challenging environments.

Telit, Telit Cinterion, GNSS module, dual band GNSS, L1 L5 GNSS, RTK GNSS, dead reckoning GNSS, IoT positioning module, satellite positioning, asset tracking GNSS, drone navigation GNSS, multi constellation GNSS, RTCM corrections, AG3335 chipset, embedded GNSS receiver

RECOM AC/DC Module Pushes 65 W Into Less Space

TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Navitas Pushes 800 VDC Directly to 6 V in AI Power

TI 800 VDC Power Architecture Reduces Conversion Stages

STMicroelectronics Pushes 800 VDC Power Closer to AI GPUs

NXP and NVIDIA Target Real-Time Data Flow in Robots

EPC’s EPC91202 GaN Inverter Board Pushes BLDC Drives to 150 kHz

Nanopower nPZero IC Changes How IoT Sensors Use Energy

Telit Dual-Band GNSS Modules Improve IoT Positioning

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