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Amphenol Expands Tru-Loc Connector Series with New 4-Way Options

Amphenol introduces 4-way Tru-Loc connectors, combining rugged sealing, RADSOK technology, and compact design for automotive and industrial applications.

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Melexis MLX81339 Brings Configurable BLDC and Stepper Motor Control to Compact Designs

Melexis’ MLX81339 motor driver combines flash programmability, sensorless FOC, and compact packaging to simplify 3-phase BLDC and stepper control up to 40 W.

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Würth Elektronik Adds New Packages to WE-CMDC Choke Series

Würth Elektronik expands its WE-CMDC chokes with compact 7060, 9070, 1513, and 1211 packages, offering high-current EMI suppression in tight spaces.

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Nexperia Shrinks Power BJT Footprint with New CFP15B Packaging

Nexperia expands its BJT range with CFP15B-packaged MJPE devices, reducing footprint by 53% while maintaining thermal performance.

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Wolfspeed Launches 200 mm SiC Wafers for High-Volume Power Device Production

Wolfspeed’s 200 mm SiC wafers and epitaxy are now commercially available, improving yields and scalability for power electronics makers worldwide.

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