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Infineon Raises SiC Module Temperature Limit To 205°C For EV Inverters

Infineon has introduced the FS01M9R13A7MA2B, a 1300 V HybridPACK Drive silicon carbide power module supporting continuous 205°C operation and up to 15% higher output current for EV traction inverters.

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Diodes Combines USB PD3.1 And Buck Control In Automotive USB-C IC

Diodes has introduced the APK43070Q, an automotive-qualified USB PD3.1 controller with integrated buck conversion, 140 W charging support, and intelligent power sharing across up to eight USB-C ports.

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Nexperia Brings QDPAK Packaging to 1200 V SiC MOSFETs

Nexperia has introduced 1200 V SiC MOSFETs in QDPAK top-side cooled packaging. The portfolio includes 17 mΩ to 80 mΩ variants, delivers up to 3 kW higher output power than D2PAK-7 devices, and targets EV, industrial, renewable energy, and datacenter power systems.

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Toshiba Introduces 40V Automotive MOSFETs in SOP Advance(EWF) Package

Toshiba has introduced the XPMR5904PB, XPMR7404PB, and XPMR8504PB 40V automotive MOSFETs. The devices use the new SOP Advance(EWF) package, support drain currents up to 180A, and deliver lower on-resistance and thermal impedance.

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