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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Filtering by tag: "QDPAK"
Clear tag filterNexperia has introduced 1200 V SiC MOSFETs in QDPAK top-side cooled packaging. The portfolio includes 17 mΩ to 80 mΩ variants, delivers up to 3 kW higher output power than D2PAK-7 devices, and targets EV, industrial, renewable energy, and datacenter power systems.
Read MoreToshiba has started test-sample shipments of the TW007D120E, a 1200V trench-gate SiC MOSFET in a top-side cooled QDPAK package for AI data center power supplies and 800V HVDC architectures.
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