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Filtering by tag: "edge AI"
Clear tag filtercongatec Extends Core Ultra COMs for Rugged Edge AI
congatec has expanded its Intel Core Ultra Series 3 COM family with rugged -40 °C to +85 °C variants for embedded edge AI and industrial systems.
Read MoreResearchers Create Flexible AI Chip For Smart Wearables
Researchers develop FLEXI, a flexible AI chip for wearables, enabling local computation, extreme bending tolerance, and energy-efficient edge intelligence.
Read MoreNXP and NVIDIA Target Real-Time Data Flow in Robots
NXP and NVIDIA introduce a robotics architecture using Holoscan Sensor Bridge to enable real-time data transport, sensor fusion, and synchronized motor control in humanoid and edge AI systems.
Read MoreTE Connectivity MezzaWave Connectors Aim at Denser 56G Links
TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.
Read MoreAdvantech i.MX 95 Modules Push Real-Time Edge AI Toward More Deterministic Control
Advantech’s i.MX 95 based modules combine multi domain compute, 2 TOPS AI acceleration, multi sensor imaging and TSN networking to support real time industrial automation, machine vision and advanced HMI systems at the edge.
Read MoreSTMicroelectronics’ Stellar P3E MCU Brings Real-Time AI Acceleration To Automotive Edge Intelligence
STMicroelectronics’ Stellar P3E automotive MCU integrates real time AI acceleration, PCM based memory and high performance Cortex R52 plus cores to support edge intelligence, virtual sensing and software defined vehicle architectures with microsecond level inference.
Read MoreQualcomm Snapdragon Wear Elite Brings On-Device AI Compute to Power-Constrained Wearables
The Qualcomm Snapdragon Wear Elite platform introduces an NPU for on-device AI, multi-mode connectivity, and power-efficient compute islands to support next-generation wearables that run complex models while maintaining multi-day battery life.
Read MoreNXP i.MX 93W Combines Edge AI Compute With Tri-Radio
NXP introduces the i.MX 93W applications processor combining a Cortex-A55 CPU, Ethos NPU delivering up to 1.8 eTOPS, and integrated Wi-Fi 6, Bluetooth LE, and 802.15.4 connectivity in a single SoC for edge AI systems.
Read MoreMicrochip’s Full-Stack Edge AI Platform Brings Real Intelligence To Low-Power MCUs And MPUs
Microchip’s full stack edge AI platform brings pre trained models, application code and unified tools to its MCUs, MPUs and FPGAs, enabling secure, efficient and production ready intelligence directly at the edge for industrial, automotive and IoT systems.
Read MoreCadence Launches HiFi iQ DSP for Next Generation Voice AI and Audio Processing
Cadence’s HiFi iQ DSP brings higher AI and audio performance for next generation voice and immersive sound applications.
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