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congatec Extends Core Ultra COMs for Rugged Edge AI

congatec has expanded its Intel Core Ultra Series 3 COM family with rugged -40 °C to +85 °C variants for embedded edge AI and industrial systems.

congatec, Intel Core Ultra Series 3, computer-on-module, COM, COM-HPC, COM Express, edge AI, embedded computing, rugged computing, industrial computing, industrial temperature, robotics, automation, transportation, energy infrastructure, smart city, railway systems

Navitas Introduces 3300 V and 2300 V UHV SiC Platform For Demanding Power Systems

Navitas adds 3300 V and 2300 V SiC devices with advanced field control and robust packaging for demanding high voltage power systems.

navitas, genesic, silicon carbide, sic mosfet, 3300 v, 2300 v, sicpak g+, power modules, high voltage design, energy infrastructure, ai datacenter power, renewables, battery storage, semiconductors

GlobalFoundries and Navitas Advance U.S. GaN Manufacturing for AI Datacenters and High-Power Systems

GlobalFoundries and Navitas form a long-term partnership to expand U.S. GaN technology and manufacturing for AI datacenters, energy and high-power systems.

globalfoundries, navitas semiconductor, gan, gan-on-si, ai datacenters, power electronics, high voltage, energy infrastructure, semiconductor manufacturing, power conversion, data center hardware

congatec Extends Core Ultra COMs for Rugged Edge AI

Navitas Introduces 3300 V and 2300 V UHV SiC Platform For Demanding Power Systems

GlobalFoundries and Navitas Advance U.S. GaN Manufacturing for AI Datacenters and High-Power Systems

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