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Alphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform

Alphawave Semi tapes out UCIe 3D IP on TSMC’s SoIC-X 3DFabric, offering 10× power efficiency and 5× signal density for AI and HPC chiplet designs.

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alphawave semi, ucie, 3dfabric, tsmc soic-x, 3d stacking, chiplet, die-to-die, ai, hpc, semiconductor packaging, semiconductors
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