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Renesas Pushes DDR5 RDIMM Speeds to 9600 MT/s with Gen6 RCD

Renesas’ sixth-generation DDR5 Registered Clock Driver achieves 9600 MT/s with expanded equalization, built-in telemetry, and backward compatibility for AI and HPC platforms.

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TI Unveils Power Solutions for Scalable AI Data Centres

Texas Instruments introduces new power management solutions and design resources to support scalable 800V AI data centre architectures.

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Alphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform

Alphawave Semi tapes out UCIe 3D IP on TSMC’s SoIC-X 3DFabric, offering 10× power efficiency and 5× signal density for AI and HPC chiplet designs.

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Bel Fuse Expands Titanium-Efficiency CRPS Lineup With TEC2700 and TEC3200

Bel Fuse’s new TEC2700 (2.7 kW) and TEC3200 (3.2 kW) CRPS front-end power supplies deliver up to 96 % efficiency, N+1 redundancy, and flexible airflow for data center and networking designs

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Synopsys Expands AI Capabilities For Chip Design Workflows

Synopsys has introduced new AI features across its EDA tools, from workflow assistants to automated verification and simulation with Ansys.

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Marvell Validates Structera CXL Across CPUs and Memory Suppliers

Marvell’s Structera CXL controllers are now validated across AMD, Intel, Micron, Samsung, and SK hynix, a milestone for AI and data-centre memory.

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TE Connectivity Launches Ultra Low-Profile PCIe Gen 7 Connectors for AI and Data Centers

TE Connectivity’s Ultra Low-Profile PCIe Gen 7 connectors deliver 128 GT/s performance in an 8.7 mm height, enabling compact, high-speed AI and data center designs.

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Kioxia Pushes Flash Memory to 5TB and 64 GB/s for Edge AI

Kioxia has built a 5TB flash module with 64 GB/s bandwidth and <40 W power, aimed at AI and edge computing in 5G/6G networks.

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