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Filtering by tag: "semiconductors"
Clear tag filterIntel Breaking the 2nm Barrier with Panther Lake on 18A Process
As the semiconductor industry pushes beyond 2nm toward angstrom-class technologies, manufacturing faces extreme physical, economic, and scientific limits. This article explores sub-2nm scaling challenges, quantum effects, EUV and high-NA lithography costs, Intel’s 18A Panther Lake ambitions, foundry expansion in the US, and why future progress may rely on chiplets, 3D packaging, and new integration strategies rather than simple transistor shrinking.
Read MoreNavitas Introduces 3300 V and 2300 V UHV SiC Platform For Demanding Power Systems
Navitas adds 3300 V and 2300 V SiC devices with advanced field control and robust packaging for demanding high voltage power systems.
Read MoreNavitas Expands GaN and SiC Power Devices for 800 V AI Data Centres
Navitas extends its GaNFast and GeneSiC semiconductor portfolio to support NVIDIA’s 800 V AI data-centre architecture with higher efficiency and density.
Read MoreRenesas Powers 800V Direct Current Architecture for AI Data Centres
Renesas’ GaN FETs and power semiconductors enable efficient 800V DC distribution in AI data centres, improving power density and reducing energy losses.
Read MoreMicrochip’s 3 nm PCIe Gen 6 Switch Targets AI Data Flow Bottlenecks
Microchip’s Switchtec Gen 6 PCIe switches improve bandwidth and latency in AI and HPC systems with 3 nm design, 160 lanes, and secure boot features.
Read MoreToshiba Unveils Miniature Automotive Zener Diodes for Surge Protection
Toshiba’s XCEZ series Zener diodes provide surge and ESD protection in compact SOD-523 packages for ADAS, BMS, and infotainment systems.
Read MoreRenesas Expands Magnet-Free Inductive Position Sensor Line for Automation and Robotics
Renesas’ new inductive position sensors provide accurate, magnet-free motion feedback for robotics and automation, supported by an online coil design tool.
Read MoreAlphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform
Alphawave Semi tapes out UCIe 3D IP on TSMC’s SoIC-X 3DFabric, offering 10× power efficiency and 5× signal density for AI and HPC chiplet designs.
Read MoreRapidus May Have Surpassed Intel 18A Logic Density
As semiconductor nodes shrink to 2nm and beyond, does smaller always mean better? Can raw logic density now define performance more than transistor size? And as companies like Rapidus challenge Intel and TSMC, who will ultimately produce the most cost-effective, reliable devices for modern applications?
Read MoreSK hynix Mass Produces 321-Layer QLC NAND for AI Storage
SK hynix launches mass production of 321-layer QLC NAND, doubling capacity and boosting performance for AI servers and enterprise SSDs.
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