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ROHM Launches DOT-247 SiC Module with 2.3× Power Density

ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.

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rohm, dot-247, silicon carbide, sic module, power electronics, pv inverters, ups systems, multi-level inverters, half-bridge, common-source, aec-q101, industrial power
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