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Filtering by tag: "silicon carbide"
Clear tag filterWeEn Launches SiC Power Module Platform for Solid-State Transformers
WeEn Semiconductors has introduced a platform of more than 20 SiC power modules for solid-state transformers, covering AC-DC and DC-DC stages with voltage ratings from 1200 V to 2300 V and on-resistance values down to 1.5 mΩ.
Read Moreonsemi Demonstrates Gate Driver Pairing Tool for SiC and GaN Designs
onsemi has introduced Elite Pairing Studio, a simulation tool that helps engineers compare gate driver and power switch combinations for SiC, GaN and MOSFET designs before system-level simulation.
Read MoreToshiba Targets AI Data Center Power Stages With 1200V SiC MOSFET
Toshiba has started test-sample shipments of the TW007D120E, a 1200V trench-gate SiC MOSFET in a top-side cooled QDPAK package for AI data center power supplies and 800V HVDC architectures.
Read MoreROHM 5th Gen SiC MOSFETs Reduce High-Temp Losses
ROHM has introduced 5th Generation EcoSiC MOSFETs for EV and industrial power systems, claiming about 30% lower ON resistance at 175°C than its 4th Generation devices, with discrete and module samples scheduled from July 2026.
Read MoreSemiQ Dual3 SiC Modules Push IGBT Drop-In Further
SemiQ’s 1200 V QSiC Dual3 half-bridge modules combine low RDSon SiC MOSFETs, optional Schottky diodes, and high power density to help replace IGBT modules in data center cooling, energy storage, and industrial power converters.
Read MoreSouth Korea Pushes For National Semiconductor Power Sovereignty
South Korea has launched a national task force led by Koo Sang-mo to achieve power semiconductor self-reliance by 2030, focusing on silicon carbide (SiC) and gallium nitride (GaN) technologies for EVs, power grids, AI data centers, defense, and robotics.
Read MoreNavitas Introduces 3300 V and 2300 V UHV SiC Platform For Demanding Power Systems
Navitas adds 3300 V and 2300 V SiC devices with advanced field control and robust packaging for demanding high voltage power systems.
Read MoreROHM Launches DOT-247 SiC Module with 2.3× Power Density
ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.
Read MoreWolfspeed Launches 200 mm SiC Wafers for High-Volume Power Device Production
Wolfspeed’s 200 mm SiC wafers and epitaxy are now commercially available, improving yields and scalability for power electronics makers worldwide.
Read MoreVishay Adds Gen 3 SiC Schottky Diodes in SlimSMA Package for Power Efficiency
Vishay launches new Gen 3 650 V and 1200 V SiC Schottky diodes with high isolation, compact size, and fast switching performance.
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