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Filtering by tag: "heterogeneous integration"

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Nisshinbo Silicon Motherboard Cuts Mounting Footprint by 80%

Nisshinbo Silicon Motherboard 3D integration technology combines ICs, wafer-formed elements and external passive components, reducing mounting footprint by about 80% in a window comparator prototype.

Nisshinbo, Nisshinbo Micro Devices, Silicon Motherboard, Si-MB, semiconductor packaging, 3D integration, 3D packaging, silicon substrate, chiplet, chiplets, heterogeneous integration, IC packaging, passive components, analog IC, comparator, window comparator, wafer processing, system integration, miniaturization, electronic components, resistors, capacitors, inductors, automotive electronics, industrial electronics

Deca and SST Partner to Advance NVM Chiplet Architectures

Deca and SST join forces to deliver modular NVM chiplets, combining Adaptive Patterning and SuperFlash technologies for advanced multi-die systems.

deca, silicon storage technology, microchip, chiplets, nvm, superflash, adaptive patterning, semiconductor packaging, heterogeneous integration, multi-die systems, advanced packaging

Nisshinbo Silicon Motherboard Cuts Mounting Footprint by 80%

Deca and SST Partner to Advance NVM Chiplet Architectures

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