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Murata Launches 100 V 10 µF Lead-Type MLCC for 48 V Systems

Murata launches 100 VDC, 10 µF lead-type MLCCs for 48 V systems, with lead wires designed to absorb mechanical stress from board flexure, vibration and thermal expansion.

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TI Launches TMCS2100-Q1 Hall-Effect Current Sensor for EV Inverters

TI introduces the TMCS2100-Q1 multiaxial coreless Hall-effect current sensor for HEV and EV traction inverters, with 20x greater accuracy than single-axis alternatives and no required busbar modifications.

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ROHM Launches 650 V IGBTs with Low Conduction Loss

ROHM launches 4th Generation 650 V IGBTs with VCE(sat) as low as 1.55 V, 7 µs short-circuit withstand time and AEC-Q101 compliance for automotive and industrial applications.

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Hirose ZE150HV Connector Supports 1000 V at 4.5 mm Pitch

Hirose ZE150HV wire-to-board connector supports 1000 V AC/DC and 10 A per pin at a 4.5 mm pitch, with a three-point contact structure and CPA mechanism for EV and HEV powertrains.

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Bourns Adds 0.1 mΩ Current Sense Resistors for High-Current Designs

Bourns adds 0.1 mΩ models to its CSS2H-5930 and CSI2H-5930 current sense resistor series, offering 15 W power handling and less than 3 nH inductance for high-current automotive and industrial applications.

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Nisshinbo Silicon Motherboard Cuts Mounting Footprint by 80%

Nisshinbo Silicon Motherboard 3D integration technology combines ICs, wafer-formed elements and external passive components, reducing mounting footprint by about 80% in a window comparator prototype.

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YAGEO Adds 150°C X8R and X8G Automotive MLCCs

YAGEO and KEMET introduce 0603 X8R and X8G automotive MLCCs with -55°C to +150°C operation, FT-CAP flexible termination supporting 5 mm board flex, AEC-Q200 qualification and voltage ratings up to 630 V.

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YAGEO Introduces PK Series Metal Current Sense Resistors for High-Power Applications

YAGEO has launched the PK Series metal current sense resistors, offering up to 5 W power ratings, resistance values down to 0.5 mΩ and AEC-Q200 qualification for automotive and industrial applications.

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NXP Combines Automotive Radio and AI Audio Processing in Single Chip

NXP has introduced the SAF9800 automotive processor, combining AM/FM radio reception and AI/ML-enabled audio processing in a single chip. The device integrates a HiFi 5 DSP, neural-network processing and hardware audio accelerators for next-generation infotainment systems.

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Toshiba Expands S-TOGL MOSFET Lineup with 40 V Automotive Device

Toshiba has introduced the XPJ1R504PB, a 40 V AEC-Q101 qualified N-channel MOSFET for automotive 12 V systems. The S-TOGL packaged device offers 120 A current capability, 1.54 mΩ maximum RDS(on) and improved thermal performance for inverters, motor drives and load switches.

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