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Nisshinbo Silicon Motherboard Cuts Mounting Footprint by 80%

Nisshinbo Silicon Motherboard 3D integration technology combines ICs, wafer-formed elements and external passive components, reducing mounting footprint by about 80% in a window comparator prototype.

Nisshinbo, Nisshinbo Micro Devices, Silicon Motherboard, Si-MB, semiconductor packaging, 3D integration, 3D packaging, silicon substrate, chiplet, chiplets, heterogeneous integration, IC packaging, passive components, analog IC, comparator, window comparator, wafer processing, system integration, miniaturization, electronic components, resistors, capacitors, inductors, automotive electronics, industrial electronics

TDK Brings High-Inductance Thin-Film Parts to Optical Transceivers in AI Data Centers

TDK’s new 10 µH thin-film inductor delivers low resistance and high reliability for optical transceivers in AI data centres.

tdk, inductors, thin-film inductors, bias-tee, ai data centers, optical modules, signal integrity, power efficiency, high frequency, servers, smartphones, wearables

Nisshinbo Silicon Motherboard Cuts Mounting Footprint by 80%

TDK Brings High-Inductance Thin-Film Parts to Optical Transceivers in AI Data Centers

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