Latest News

The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

Not A Member? Join The Club Now!

Filtering by tag: "semiconductor innovation"

Clear tag filter

Chinese University Creates 3D Chip Design Tool for Huawei’s Logic Folding Architecture

Recently we covered Huawei’s development of a LogicFolding technology to increase device density, but now researchers from China have created a tool to help convert chip designs into 3D folded structures. What exactly does the tool do and why could technologies like Logic Folding be the future for semiconductors?

3D chip design, LogicFolding architecture, Huawei semiconductors, Peking University EDA tool, electronic design automation, 3D integrated circuits, vertical chip integration, semiconductor density, Kirin processors, Tau Scaling Law, ISCAS 2026, chip layout complexity, domestic Chinese EDA tools, transistor scaling, semiconductor innovation, chip design tools, 3D chip technology

Samsung First to Build 3D Stacked Transistors

Finally, it looks like that we may be entering the next era of semiconductor design, utilizing stacked transistor designs. Samsung has just announced that it is the first to achieve a 3D stacked design that could instantly double the number of devices on a die, and if their claims are true, could be a game-changer for the industry and technology as a whole.

Samsung 3D stacked transistors, 3D stacked FET, vertical transistor technology, semiconductor innovation, logic chip stacking, transistor density, AI chip advancements, high-performance computing semiconductors, 42 nm gate pitch, RBC vertical contact, SRAM 3D logic

Chinese University Creates 3D Chip Design Tool for Huawei’s Logic Folding Architecture

Samsung First to Build 3D Stacked Transistors

Latest News

Information

Manage

Enquire