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Renesas Launches RZ/G3L and RZ/G3SE MPUs for HMI and IoT Edge Systems

Renesas launches RZ/G3L and RZ/G3SE MPUs with Cortex-A55 processing, 1 mW-level Linux standby, PCIe and TSN for HMI and IoT edge systems.

Uploaded image Renesas has added two 64-bit general-purpose microprocessors to its RZ/G Series. The new RZ/G3L and RZ/G3SE are aimed at industrial and consumer HMI systems, IoT gateways and home gateways that need higher processing performance and high-speed network connectivity.

Processing comes from up to four Arm Cortex-A55 cores running at 1.2 GHz, with a Cortex-M33 coprocessor running at 200 MHz. Renesas has made the RZ/G3L and RZ/G3SE pin-compatible, so the same PCB design can be used for different product variants.

The RZ/G3L includes a GPU for 3D graphics rendering and an H.264 video codec, making it suitable for smart retail terminals and medical HMI equipment. The RZ/G3SE is intended for applications with simpler display requirements, including EV chargers and industrial gateways.

1 mW-Level Standby with Linux Retention

The third-generation RZ/G Series uses a new power management architecture that brings standby consumption down to the 1 mW level in deep standby mode. The Linux system can remain in memory during standby and resume quickly when the system is needed again.

This is intended for industrial and IoT equipment that needs to remain available or connected without running continuously at full power. Both MPUs are also supported by Renesas' Verified Linux Package, which is compliant with the Civil Infrastructure Platform for long-term support.

PCIe and TSN for System Expansion

High-speed interfaces include PCIe, TSN-capable Gigabit Ethernet and USB. PCIe can connect 5G communication modules, Wi-Fi 6 modules or external AI accelerators, while the TSN-capable Ethernet interface is intended for industrial networks where low-latency and reliable communication are required.

ECC is included on both the on-chip memory and external DDR interface. Security features cover Renesas Secure IP, Secure Boot, Arm TrustZone and tamper detection. The RZ/G3L and RZ/G3SE are offered in quad-core and dual-core configurations, with an operating temperature range from -40°C to +125°C. Package options include a 14 mm square 400-pin LFBGA and a 17 mm square 368-pin LFBGA.

Common Hardware for Different HMI Requirements

Pin compatibility gives developers the option of using the same PCB across systems with different display and processing requirements. A design requiring 3D graphics and video can use the RZ/G3L, while the RZ/G3SE can be used on the same hardware platform where only basic display functionality is required.

Renesas is supporting the devices with GUI development environments, operating systems, software and system-on-modules. Evaluation kits are available for both MPUs, combining a SMARC v2.1 module board with a carrier board.

The RZ/G3L and RZ/G3SE are available now.

Learn more and read the original announcement at renesas.com.


Technology Overview

The Renesas RZ/G3L and RZ/G3SE are 64-bit general-purpose MPUs for HMI and IoT edge systems. They offer up to four 1.2 GHz Arm Cortex-A55 cores, a 200 MHz Cortex-M33, 1 mW-level deep standby with Linux retention, PCIe and TSN-capable Gigabit Ethernet.

FAQs

What is the difference between the RZ/G3L and RZ/G3SE?

The RZ/G3L includes a GPU for 3D graphics and an H.264 video codec, while the RZ/G3SE is aimed at systems with more basic display requirements. The two devices are pin-compatible.

What processors are used in the RZ/G3L and RZ/G3SE?

The devices are available with up to four Arm Cortex-A55 application cores running at 1.2 GHz, together with a Cortex-M33 coprocessor running at 200 MHz.

What connectivity do the new RZ/G MPUs support?

The RZ/G3L and RZ/G3SE include PCIe, TSN-capable Gigabit Ethernet and USB. PCIe can also be used for 5G and Wi-Fi 6 modules or external AI accelerators.

About the author

Renesas

Renesas Electronics Corporation delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices. Their wide-ranging portfolio spans MCUs, SoCs, analog, power, and wide-bandgap devices, serving automotive, industrial, and infrastructure markets worldwide.

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